Turner, K.T. and Spearing, S.M. (2004) Role of wafer bow and etch patterns in direct wafer bonding. The Seventh International Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications, Paris, France. 26 Apr - 01 May 2003. pp. 166-174 .
Record type:
Conference or Workshop Item
(Paper)
This record has no associated files available for download.
More information
Published date: 2004
Additional Information:
Abstract No. 1028
Venue - Dates:
The Seventh International Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications, Paris, France, 2003-04-26 - 2003-05-01
Related URLs:
Identifiers
Local EPrints ID: 23282
URI: http://eprints.soton.ac.uk/id/eprint/23282
PURE UUID: 6fff31f2-485e-4707-ac69-a53f50509484
Catalogue record
Date deposited: 14 Mar 2006
Last modified: 12 Dec 2021 03:26
Export record
Contributors
Author:
K.T. Turner
Download statistics
Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.