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Thermal conductivity of molten lead free solders

Bilek, Jaromir, Atkinson, John and Wakeham, William (2004) Thermal conductivity of molten lead free solders At European Microelectronics and Packaging Symposium. 16 - 18 Jun 2004. 6 pp.

Record type: Conference or Workshop Item (Paper)


The increasing influence of computational modelling in all technological processes generates an increased demand for accurate values of the physical properties of the materials involved, which are used as fundamental inputs for every model. In the production of electronic circuits, a thorough knowledge of the thermal conductivity of molten solders can result in a better controlled soldering process. As a result, this information can be used for setting the optimum soldering profile and thereby lead to improvement in the quality control of the solder joints. This paper describes the principles of the experimental technique employed for the measurement of the thermal conductivity of molten solders and describes the essential features of the instrumentation. The values of the thermal conductivity of different lead and lead-free solder compositions, measured at various temperatures and temperature profiles, are compared and briefly discussed.

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Published date: 2004
Venue - Dates: European Microelectronics and Packaging Symposium, 2004-06-16 - 2004-06-18


Local EPrints ID: 23346
PURE UUID: 8fe05443-fc77-4e3f-bbc6-562fb77a510b
ORCID for John Atkinson: ORCID iD

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Date deposited: 09 Mar 2007
Last modified: 17 Jul 2017 16:17

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Author: Jaromir Bilek
Author: John Atkinson ORCID iD
Author: William Wakeham

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