Bilek, Jaromir, Atkinson, John and Wakeham, William
Thermal conductivity of molten lead free solders
At European Microelectronics and Packaging Symposium.
16 - 18 Jun 2004.
Restricted to Registered users only
The increasing influence of computational modelling in all technological
processes generates an increased demand for accurate values of the physical
properties of the materials involved, which are used as fundamental inputs
for every model.
In the production of electronic circuits, a thorough knowledge of the
thermal conductivity of molten solders can result in a better controlled
soldering process. As a result, this information can be used for setting the
optimum soldering profile and thereby lead to improvement in the quality
control of the solder joints.
This paper describes the principles of the experimental technique employed
for the measurement of the thermal conductivity of molten solders and
describes the essential features of the instrumentation. The values of the
thermal conductivity of different lead and lead-free solder compositions,
measured at various temperatures and temperature profiles, are compared
and briefly discussed.
Conference or Workshop Item
|Venue - Dates:
||European Microelectronics and Packaging Symposium, 2004-06-16 - 2004-06-18
||09 Mar 2007
||16 Apr 2017 22:45
|Further Information:||Google Scholar|
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