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Low-temperature superplasticity in a Cu-Zn-Sn alloy processed by severe plastic deformation

Neishi, K., Uchida, T., Yamauchi, A., Nakamura, K., Horita, Z. and Langdon, T.G. (2001) Low-temperature superplasticity in a Cu-Zn-Sn alloy processed by severe plastic deformation Materials Science and Engineering, 307, (1-2), pp. 23-28. (doi:10.1016/S0921-5093(00)01970-5).

Record type: Article


A copper alloy containing 38% Zn and 3% Sn was subjected to severe plastic deformation at a temperature of 400°C using the procedure of equal-channel angular pressing (ECAP). The microstructures produced by ECAP were relatively heterogeneous with areas of both recrystallized and unrecrystallized grains. Within the recrystallized areas, the average grain size was 1.5?m. Tensile testing after ECAP revealed the occurrence of superplasticity with elongations up to 900%. Superplastic ductilities were recorded at temperatures as low as 300°C corresponding to an homologous temperature of 0.51Tm, where Tm is the absolute melting temperature of the alloy. These results demonstrate the potential for achieving low temperature superplasticity in this alloy through ECAP. As in conventional superplastic Cu-based alloys, specimens failed because of the development of internal cavities.

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Published date: 2001


Local EPrints ID: 23410
PURE UUID: 59ac59f2-5cbb-44ed-84a7-653ee8ba33ff
ORCID for T.G. Langdon: ORCID iD

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Date deposited: 23 Mar 2006
Last modified: 17 Jul 2017 16:17

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Author: K. Neishi
Author: T. Uchida
Author: A. Yamauchi
Author: K. Nakamura
Author: Z. Horita
Author: T.G. Langdon ORCID iD

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