Creep at low stresses: an evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms
Creep at low stresses: an evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms
High-temperature creep experiments often reveal a transition at very low stresses to a region where the stress exponent is reduced to a value lying typically in the range of ~1 to 2. This region is generally associated with the occurrence of a new creep mechanism, such as grain-boundary sliding, diffusion creep, and/or Harper–Dorn creep. Several recent reports have suggested that diffusion creep and Harper–Dorn creep may not be viable creep mechanisms. This article examines these two processes and demonstrates that there is good evidence supporting the occurrence of both creep mechanisms under at least some experimental conditions.
249-259
Langdon, T.G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
2002
Langdon, T.G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Langdon, T.G.
(2002)
Creep at low stresses: an evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms.
Metallurgical and Materials Transactions A, 33 (2), .
Abstract
High-temperature creep experiments often reveal a transition at very low stresses to a region where the stress exponent is reduced to a value lying typically in the range of ~1 to 2. This region is generally associated with the occurrence of a new creep mechanism, such as grain-boundary sliding, diffusion creep, and/or Harper–Dorn creep. Several recent reports have suggested that diffusion creep and Harper–Dorn creep may not be viable creep mechanisms. This article examines these two processes and demonstrates that there is good evidence supporting the occurrence of both creep mechanisms under at least some experimental conditions.
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Published date: 2002
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Local EPrints ID: 23806
URI: http://eprints.soton.ac.uk/id/eprint/23806
ISSN: 1073-5623
PURE UUID: b0afe5da-7cbc-4fb9-8171-4cd9e71d36a1
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Date deposited: 28 Mar 2006
Last modified: 09 Jan 2022 03:09
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