Hughes, J.F., Crockett, R.G.M., Pude, J. and Singh, S. (1985) Bonding Wire Discharges in Integrated Circuit Packages. Journal of Electrostatics, 16 (243), 343-52.
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Published date: 1985
Organisations:
Electronics & Computer Science
Identifiers
Local EPrints ID: 255806
URI: http://eprints.soton.ac.uk/id/eprint/255806
ISSN: 0304-3886
PURE UUID: 4827ac9c-a65b-44dd-a3ea-49e823e1fe27
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Date deposited: 09 May 2001
Last modified: 10 Dec 2021 20:39
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Contributors
Author:
J.F. Hughes
Author:
R.G.M. Crockett
Author:
J. Pude
Author:
S. Singh
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