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Bonding Wire Discharges in Integrated Circuit Packages

Bonding Wire Discharges in Integrated Circuit Packages
Bonding Wire Discharges in Integrated Circuit Packages
0304-3886
343-52
Hughes, J.F.
d6a276c8-a7e5-46d9-9b3a-e7be07d4ddfc
Crockett, R.G.M.
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Pude, J.
aa70057a-a763-4595-a9af-e6cfc07761e2
Singh, S.
a9cd7e50-e572-4cba-a98d-f3f73372097b
Hughes, J.F.
d6a276c8-a7e5-46d9-9b3a-e7be07d4ddfc
Crockett, R.G.M.
61c2bbd8-872f-41af-a9ed-67a4f68d6bec
Pude, J.
aa70057a-a763-4595-a9af-e6cfc07761e2
Singh, S.
a9cd7e50-e572-4cba-a98d-f3f73372097b

Hughes, J.F., Crockett, R.G.M., Pude, J. and Singh, S. (1985) Bonding Wire Discharges in Integrated Circuit Packages. Journal of Electrostatics, 16 (243), 343-52.

Record type: Article

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More information

Published date: 1985
Organisations: Electronics & Computer Science

Identifiers

Local EPrints ID: 255806
URI: https://eprints.soton.ac.uk/id/eprint/255806
ISSN: 0304-3886
PURE UUID: 4827ac9c-a65b-44dd-a3ea-49e823e1fe27

Catalogue record

Date deposited: 09 May 2001
Last modified: 18 Jul 2017 09:51

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Contributors

Author: J.F. Hughes
Author: R.G.M. Crockett
Author: J. Pude
Author: S. Singh

University divisions

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