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On optimisation of Nickel electroforming for MEMS applications

Grigore, L, Ensell, GJ, Evans, AGR, Elejalde, N and Lee, S (2002) On optimisation of Nickel electroforming for MEMS applications At Micromechanics Europe, Romania. , pp. 83-86.

Record type: Conference or Workshop Item (Paper)


This paper presents the details of an optimum nickel electroforming process for MEMS applications. Electrochemical deposition of nickel microstructures in thick resist moulds from a standard process using a sulphamate electrlyte gives most of the time poor quality deposits: non uniform, sometimes with pitting and without adherence on the substrate. As in MEMS devices the features to be electroplated are of micron size (which creates a big disproportion in the surface area between the two electrodes involved in the plating bath), an optimisation of the standard electroplating rocess was developed.

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Published date: 2002
Additional Information: Event Dates: October 6-8th 2002
Venue - Dates: Micromechanics Europe, Romania, 2002-10-08
Keywords: thick resist mould, sulphamate electroplating bath, nickel microstructures
Organisations: Nanoelectronics and Nanotechnology


Local EPrints ID: 257591
PURE UUID: 1791a503-3cdf-4d98-a296-873a60764e16

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Date deposited: 26 Aug 2004
Last modified: 18 Jul 2017 09:38

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Author: L Grigore
Author: GJ Ensell
Author: AGR Evans
Author: N Elejalde
Author: S Lee

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