Grigore, L, Ensell, GJ, Evans, AGR, Elejalde, N and Lee, S
On optimisation of Nickel electroforming for MEMS applications
At Micromechanics Europe, Romania.
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This paper presents the details of an optimum nickel electroforming process for MEMS applications. Electrochemical deposition of nickel microstructures in thick resist moulds from a standard process using a sulphamate electrlyte gives most of the time poor quality deposits: non uniform, sometimes with pitting and without adherence on the substrate. As in MEMS devices the features to be electroplated are of micron size (which creates a big disproportion in the surface area between the two electrodes involved in the plating bath), an optimisation of the standard electroplating rocess was developed.
Conference or Workshop Item
||Event Dates: October 6-8th 2002
|Venue - Dates:
||Micromechanics Europe, Romania, 2002-10-08
||thick resist mould, sulphamate electroplating bath, nickel microstructures
||Nanoelectronics and Nanotechnology
||26 Aug 2004
||17 Apr 2017 22:50
|Further Information:||Google Scholar|
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