On optimisation of Nickel electroforming for MEMS applications

Grigore, L, Ensell, GJ, Evans, AGR, Elejalde, N and Lee, S (2002) On optimisation of Nickel electroforming for MEMS applications At Micromechanics Europe, Romania. , pp. 83-86.


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This paper presents the details of an optimum nickel electroforming process for MEMS applications. Electrochemical deposition of nickel microstructures in thick resist moulds from a standard process using a sulphamate electrlyte gives most of the time poor quality deposits: non uniform, sometimes with pitting and without adherence on the substrate. As in MEMS devices the features to be electroplated are of micron size (which creates a big disproportion in the surface area between the two electrodes involved in the plating bath), an optimisation of the standard electroplating rocess was developed.

Item Type: Conference or Workshop Item (Paper)
Additional Information: Event Dates: October 6-8th 2002
Venue - Dates: Micromechanics Europe, Romania, 2002-10-08
Keywords: thick resist mould, sulphamate electroplating bath, nickel microstructures
Organisations: Nanoelectronics and Nanotechnology
ePrint ID: 257591
Date :
Date Event
Date Deposited: 26 Aug 2004
Last Modified: 17 Apr 2017 22:50
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/257591

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