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Electroplating moulds using dry film thick negative photoresist

Electroplating moulds using dry film thick negative photoresist
Electroplating moulds using dry film thick negative photoresist
This paper reports on progress on the feasibility of fabricating moulds for electroplating using Ordyl P-50100 (negative) acrylate polymer based dry film photoresist, commercially available from Elga Europe (http://www.elgaeurope.it). We used this photoresist as an alternative to SU8 negative epoxy based photoresist, which is very difficult to process and remove after electroplating (Lorenz et al 1998 Microelectron. Eng. 41/42 371–4, Eyre et al 1998 Proc. MEMS’98 (Heidelberg) (Piscataway, NJ: IEEE) pp 218–22). Ordyl P-50100 is easy to work with and can be easily removed after processing. A single layer of Ordyl P-50100 was deposited by lamination up to 20 µm thickness. Thicker layers (200 µm and more) can be achieved with multilayer lamination using a manual laminator. For our applications we found that Ordyl P-50100 dry film photoresist is a very good alternative to SU8 for the realization of 100 µm high moulds. The results presented will open up new possibilities for low-cost LIGA-type processes for MEMS applications.
1361-6439
S67
Kukharenka, A
b34ae878-2776-4088-8880-5b2bd4f33ec3
Farooqui, M
e9978a97-af07-4408-ba69-939e5b50f0f7
Grigore, Luminita
228f9316-49f4-47ad-a408-bc2b5ecad1d4
Kraft, Michael
54927621-738f-4d40-af56-a027f686b59f
Hollinshead, N
5da06002-2497-487f-95bd-5b8fe3329478
Kukharenka, A
b34ae878-2776-4088-8880-5b2bd4f33ec3
Farooqui, M
e9978a97-af07-4408-ba69-939e5b50f0f7
Grigore, Luminita
228f9316-49f4-47ad-a408-bc2b5ecad1d4
Kraft, Michael
54927621-738f-4d40-af56-a027f686b59f
Hollinshead, N
5da06002-2497-487f-95bd-5b8fe3329478

Kukharenka, A, Farooqui, M, Grigore, Luminita, Kraft, Michael and Hollinshead, N (2003) Electroplating moulds using dry film thick negative photoresist. Journal of Micromechanics and Microengineering, 13 (4), S67. (doi:10.1088/0960-1317/13/4/311).

Record type: Article

Abstract

This paper reports on progress on the feasibility of fabricating moulds for electroplating using Ordyl P-50100 (negative) acrylate polymer based dry film photoresist, commercially available from Elga Europe (http://www.elgaeurope.it). We used this photoresist as an alternative to SU8 negative epoxy based photoresist, which is very difficult to process and remove after electroplating (Lorenz et al 1998 Microelectron. Eng. 41/42 371–4, Eyre et al 1998 Proc. MEMS’98 (Heidelberg) (Piscataway, NJ: IEEE) pp 218–22). Ordyl P-50100 is easy to work with and can be easily removed after processing. A single layer of Ordyl P-50100 was deposited by lamination up to 20 µm thickness. Thicker layers (200 µm and more) can be achieved with multilayer lamination using a manual laminator. For our applications we found that Ordyl P-50100 dry film photoresist is a very good alternative to SU8 for the realization of 100 µm high moulds. The results presented will open up new possibilities for low-cost LIGA-type processes for MEMS applications.

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More information

Published date: 2003
Additional Information: Paper orginally given at 13th European Micromechanics Workshop, 6-8 Oct. 2002
Venue - Dates: Micromechanics Europe (MME 2002): 13th European Micromechanics Workshop, Romania, 2002-10-06 - 2002-10-08
Organisations: Nanoelectronics and Nanotechnology, EEE

Identifiers

Local EPrints ID: 257797
URI: http://eprints.soton.ac.uk/id/eprint/257797
ISSN: 1361-6439
PURE UUID: bf727fe4-a9e4-403b-b7b7-146b953ff21f

Catalogue record

Date deposited: 27 Oct 2004
Last modified: 25 Nov 2019 21:08

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