Realisation of electroplating moulds with different thick photoresists for MEMs applications.
Realisation of electroplating moulds with different thick photoresists for MEMs applications.
165-168
Kukharenka, A
1dff90b0-3ae7-489d-ae20-50beca17c89a
Kraft, Michael
c2ff2439-b909-4af3-824d-9d7c0d14dc3e
2002
Kukharenka, A
1dff90b0-3ae7-489d-ae20-50beca17c89a
Kraft, Michael
c2ff2439-b909-4af3-824d-9d7c0d14dc3e
Kukharenka, A and Kraft, Michael
(2002)
Realisation of electroplating moulds with different thick photoresists for MEMs applications.
4th International Conference on Material for Microelectronics and Nanoengineering, Espoo, Finland.
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Record type:
Conference or Workshop Item
(Paper)
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Published date: 2002
Additional Information:
Event Dates: June 2002
Venue - Dates:
4th International Conference on Material for Microelectronics and Nanoengineering, Espoo, Finland, 2002-05-31
Organisations:
Nanoelectronics and Nanotechnology
Identifiers
Local EPrints ID: 257820
URI: http://eprints.soton.ac.uk/id/eprint/257820
PURE UUID: 6877ea64-66d4-4f9c-b689-f6cfa1e5d235
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Date deposited: 27 Oct 2004
Last modified: 10 Dec 2021 20:53
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Contributors
Author:
A Kukharenka
Author:
Michael Kraft
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