Gonciari, Paul Theo, Al-Hashimi, Bashir and Nicolici, Nicola
Test Data Compression: The System Integrator’s Perspective
At Design Automation and Test in Europe, Germany.
03 - 07 Mar 2003.
This is the latest version of this item.
Test data compression (TDC) is a promising low-cost methodology for System-on-a-Chip (SOC) test. This is due to the fact that it can reduce not only the volume of test data but also the bandwidth requirements. In this paper we provide a quantitative analysis of two distinctive TDC methods from the system integrator’s standpoint considering a core based SOC environment. The proposed analysis addresses four parameters: compression ratio, test application time, area overhead and power dissipation. Based on our analysis, some future research directions are given which can lead to an easier integration of TDC in the SOC design flow and to further improve the four parameters.
Conference or Workshop Item
||Event Dates: 3-7 March, 2003
|Venue - Dates:
||Design Automation and Test in Europe, Germany, 2003-03-03 - 2003-03-07
||Electronic & Software Systems
||28 Oct 2003
||17 Apr 2017 22:43
|Further Information:||Google Scholar|
Available Versions of this Item
Actions (login required)