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Test Data Compression: The System Integrator’s Perspective

Test Data Compression: The System Integrator’s Perspective
Test Data Compression: The System Integrator’s Perspective
Test data compression (TDC) is a promising low-cost methodology for System-on-a-Chip (SOC) test. This is due to the fact that it can reduce not only the volume of test data but also the bandwidth requirements. In this paper we provide a quantitative analysis of two distinctive TDC methods from the system integrator’s standpoint considering a core based SOC environment. The proposed analysis addresses four parameters: compression ratio, test application time, area overhead and power dissipation. Based on our analysis, some future research directions are given which can lead to an easier integration of TDC in the SOC design flow and to further improve the four parameters.
726-731
Gonciari, Paul Theo
a7b9003b-b7d9-4ae6-8164-d878a0b59e43
Al-Hashimi, Bashir
0b29c671-a6d2-459c-af68-c4614dce3b5d
Nicolici, Nicola
61efa5a6-7da8-4c33-8e68-2679a9bb0871
Gonciari, Paul Theo
a7b9003b-b7d9-4ae6-8164-d878a0b59e43
Al-Hashimi, Bashir
0b29c671-a6d2-459c-af68-c4614dce3b5d
Nicolici, Nicola
61efa5a6-7da8-4c33-8e68-2679a9bb0871

Gonciari, Paul Theo, Al-Hashimi, Bashir and Nicolici, Nicola (2003) Test Data Compression: The System Integrator’s Perspective At Design Automation and Test in Europe, Germany. 03 - 07 Mar 2003. , pp. 726-731.

Record type: Conference or Workshop Item (Paper)

Abstract

Test data compression (TDC) is a promising low-cost methodology for System-on-a-Chip (SOC) test. This is due to the fact that it can reduce not only the volume of test data but also the bandwidth requirements. In this paper we provide a quantitative analysis of two distinctive TDC methods from the system integrator’s standpoint considering a core based SOC environment. The proposed analysis addresses four parameters: compression ratio, test application time, area overhead and power dissipation. Based on our analysis, some future research directions are given which can lead to an easier integration of TDC in the SOC design flow and to further improve the four parameters.

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More information

Published date: 2003
Additional Information: Event Dates: 3-7 March, 2003
Venue - Dates: Design Automation and Test in Europe, Germany, 2003-03-03 - 2003-03-07
Organisations: Electronic & Software Systems

Identifiers

Local EPrints ID: 258419
URI: http://eprints.soton.ac.uk/id/eprint/258419
PURE UUID: a2b92140-e296-4620-816e-ce56ba5be0aa

Catalogue record

Date deposited: 28 Oct 2003
Last modified: 18 Jul 2017 09:32

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Contributors

Author: Paul Theo Gonciari
Author: Nicola Nicolici

University divisions

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