Effect of fluorine implantation dose on boron thermal diffusion in silicon

El Mubarek, H.A.W., Bonar, J.M., Dilliway, G.D., Ashburn, P., Karunaratne, M., Willoughby, A.F., Wang, Y., Hemment, P.L.F., Price, R., Zhang, J. and Ward, P. (2004) Effect of fluorine implantation dose on boron thermal diffusion in silicon Journal of Applied Physics, 96, (8), pp. 4114-4121.


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This paper investigates how the thermal diffusion of boron in silicon is influenced by a high energy fluorine implant with a dose in the range 5?1014 to 2.3?1015cm-2. SIMS profiles of boron marker layers are presented for different fluorine doses and compared with fluorine profiles to establish the conditions under which thermal boron diffusion is suppressed. The SIMS profiles show significantly reduced boron thermal diffusion above a critical F+ dose of 0.9-1.4?1015cm-2. Fitting of the measured boron profiles gives suppressions of the boron thermal diffusion coefficient by factors of 1.9 and 3.7 for F+ implantation doses of 1.4?1015 and 2.3?1015cm-2 respectively. The suppression of boron thermal diffusion above the critical fluorine dose correlates with the appearance of a shallow fluorine peak on the SIMS profile in the vicinity of the boron marker layer. This shallow fluorine peak is present in samples with and without boron marker layers, and hence it is not due to a chemical interaction between the boron and the fluorine. Analysis of the SIMS profiles and cross-section TEM images suggests that it is due to the trapping of fluorine at vacancy-fluorine clusters, and that the suppression of the boron thermal diffusion is due to the effect of the clusters in suppressing the interstitial concentration in the vicinity of the boron profile.

Item Type: Article
ISSNs: 0021-8979 (print)
Keywords: fluorine, diffusion, boron
Organisations: Nanoelectronics and Nanotechnology
ePrint ID: 260245
Date :
Date Event
August 2004Published
Date Deposited: 11 Jan 2005
Last Modified: 17 Apr 2017 22:16
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/260245

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