Reduction of boron diffusion in silicon-germanium by fluorine implantation


El Mubarek, H.A.W. and Ashburn, P. (2004) Reduction of boron diffusion in silicon-germanium by fluorine implantation IEEE Electron Device Letters, 25, (8), pp. 535-537.

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Description/Abstract

This paper investigates the effect of a 185 keV, 2.3?1015cm-2 F+ implant on boron thermal diffusion and boron transient enhanced diffusion (TED) in SiGe by characterising the diffusion of a boron marker layer in samples with and without a 288 keV, 6?1013cm-2 P+ implant. In samples implanted with F+ only, the fluorine suppresses boron thermal diffusion by 58%. In samples given both P+ and F+ implants, the fluorine completely eliminates boron transient enhanced diffusion caused by the P+ implant and also significantly reduces boron thermal diffusion. SIMS profiles after anneal show a fluorine concentration in the SiGe layer that is approximately 8? higher than after implant, indicating that fluorine accumulates in the SiGe layer during anneal. A comparison with fluorine profiles in comparable silicon samples also shows that the fluorine concentration after anneal is dramatically higher in SiGe samples than in Si samples. This accumulation of fluorine in the SiGe layer during anneal will have major benefits for boron diffusion suppression in devices like SiGe HBTs, where boron must be kept within the SiGe layer.

Item Type: Article
ISSNs: 0741-3106 (print)
Keywords: silicon, germanium, fluorine, diffusion, boron
Organisations: Nanoelectronics and Nanotechnology
ePrint ID: 260247
Date :
Date Event
2004Published
Date Deposited: 10 Jan 2005
Last Modified: 17 Apr 2017 22:16
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/260247

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