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Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures

Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures
Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures
Elejalde, N.
76c8c340-722e-49dc-8298-2c1a8db07fde
Grigore, L.
15f32968-e43a-4a58-979d-9b88eb196ce6
Ensell, G.J.
95aed82a-8c62-473f-94f2-1574f9da495c
Evans, A.G.R.
082f720d-3830-46d7-ba87-b058af733bc3
Lee, S.L.
b06eee97-8145-4b15-bd10-6723f53b81a7
Ogrin, F.Y.
4bbc9858-8e9a-47ab-ad71-d2eb17d080e9
Elejalde, N.
76c8c340-722e-49dc-8298-2c1a8db07fde
Grigore, L.
15f32968-e43a-4a58-979d-9b88eb196ce6
Ensell, G.J.
95aed82a-8c62-473f-94f2-1574f9da495c
Evans, A.G.R.
082f720d-3830-46d7-ba87-b058af733bc3
Lee, S.L.
b06eee97-8145-4b15-bd10-6723f53b81a7
Ogrin, F.Y.
4bbc9858-8e9a-47ab-ad71-d2eb17d080e9

Elejalde, N., Grigore, L., Ensell, G.J., Evans, A.G.R., Lee, S.L. and Ogrin, F.Y. (2001) Positive and Negative Photoresist as Thick Moulds for Electroplating High Aspect Ratio 3D Structures. Micromechanics Europe 2001. 04 - 06 Oct 2001.

Record type: Conference or Workshop Item (Other)

Full text not available from this repository.

More information

Published date: 2001
Additional Information: Event Dates: 4th-6th October 2001
Venue - Dates: Micromechanics Europe 2001, 2001-10-04 - 2001-10-06
Organisations: Nanoelectronics and Nanotechnology

Identifiers

Local EPrints ID: 260451
URI: https://eprints.soton.ac.uk/id/eprint/260451
PURE UUID: 0195673e-ad5d-4bac-90f3-4439beb1f748

Catalogue record

Date deposited: 07 Feb 2005
Last modified: 18 Jul 2017 09:12

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