Comparison between bulk micromachined and CMOS X-ray detectors

Rocha, J.G., Schabmueller, C.G.J., Ramos, N.F., Lanceros-Mendez, S., Moreira, M.V., Evans, A.G.R., Wolffenbuttel, R.F. and Correia, J.H. (2004) Comparison between bulk micromachined and CMOS X-ray detectors Sensors and Actuators A: Physical, 115, (2-3), pp. 215-220.


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This paper compares two X-ray detectors fabricated using two different technologies: one is based on a bulk micromachined silicon photodetector and the other is based on a standard CMOS photodetector. The working principle of the two detectors is similar: a scintillating layer of CsI:TI is placed above the photodetector, so the X-rays are first converted into visible light (560 nm) which is then converted into an electrical signal by the photodetector. The different aspects of the fabrication and the experimental results of both X-ray detectors are presented and discussed. (C) 2004 Elsevier B.V. All rights reserved.

Item Type: Article
ISSNs: 0924-4247 (print)
Keywords: X-rays, scintillator, micromachining
Organisations: Nanoelectronics and Nanotechnology
ePrint ID: 260882
Date :
Date Event
September 2004Published
Date Deposited: 17 May 2005
Last Modified: 17 Apr 2017 22:08
Further Information:Google Scholar

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