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A comparative study of different thick photoresists for MEMS applications

A comparative study of different thick photoresists for MEMS applications
A comparative study of different thick photoresists for MEMS applications
This work reports on recent advances in microfabrication process technology for medium to high-aspect ratio structures realised by UV photolithography using different kinds of photoresists. The resulting structures were used as moulds and will be translated into metallic structures by electroplating. We used four types of photoresists: SPR 220-7 novalak based (positive), SU8 epoxy based (negative), Ordyl P-50100 acrylate based (negative) dry film photoresist, and Diaplate 132 acrylate based wet photoresist (negative). The motivation for this work was to find an alternative to SU-8 photoresist, which is difficult to process and remove after electroplating. Depending on the application, we found that Ordyl P-50100 dry film photoresist is the best alternative to SU8 for realization of approximately 100 μm deep moulds for electroplating in acidic electroplating solution. SPR 220-7 is a good alternative to SU8 for fabrication of 50 μm deep moulds and electroplating in alkaline solutions.

The results presented in this paper will open up new possibilities for low-cost processes using electroplating for MEMS applications.
741-747
Koukharenko, E.
b34ae878-2776-4088-8880-5b2bd4f33ec3
Kraft, M.
54927621-738f-4d40-af56-a027f686b59f
Ensell, G.
736a04bf-1a14-42c2-928b-ed7af799cd3a
Hollinshead, N.
8bd68515-ed1a-4f85-8bdd-a0f5c0ad65b9
Koukharenko, E.
b34ae878-2776-4088-8880-5b2bd4f33ec3
Kraft, M.
54927621-738f-4d40-af56-a027f686b59f
Ensell, G.
736a04bf-1a14-42c2-928b-ed7af799cd3a
Hollinshead, N.
8bd68515-ed1a-4f85-8bdd-a0f5c0ad65b9

Koukharenko, E., Kraft, M., Ensell, G. and Hollinshead, N. (2005) A comparative study of different thick photoresists for MEMS applications. Journal of Materials Science: Materials in Electronics, 16 (11-12), 741-747. (doi:10.1007/s10854-005-4977-2).

Record type: Article

Abstract

This work reports on recent advances in microfabrication process technology for medium to high-aspect ratio structures realised by UV photolithography using different kinds of photoresists. The resulting structures were used as moulds and will be translated into metallic structures by electroplating. We used four types of photoresists: SPR 220-7 novalak based (positive), SU8 epoxy based (negative), Ordyl P-50100 acrylate based (negative) dry film photoresist, and Diaplate 132 acrylate based wet photoresist (negative). The motivation for this work was to find an alternative to SU-8 photoresist, which is difficult to process and remove after electroplating. Depending on the application, we found that Ordyl P-50100 dry film photoresist is the best alternative to SU8 for realization of approximately 100 μm deep moulds for electroplating in acidic electroplating solution. SPR 220-7 is a good alternative to SU8 for fabrication of 50 μm deep moulds and electroplating in alkaline solutions.

The results presented in this paper will open up new possibilities for low-cost processes using electroplating for MEMS applications.

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More information

Published date: November 2005
Organisations: Nanoelectronics and Nanotechnology

Identifiers

Local EPrints ID: 261723
URI: http://eprints.soton.ac.uk/id/eprint/261723
PURE UUID: a442b8c2-ce19-4ea9-9982-d8df4718cfb1

Catalogue record

Date deposited: 22 Dec 2005
Last modified: 14 Mar 2024 06:57

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Contributors

Author: E. Koukharenko
Author: M. Kraft
Author: G. Ensell
Author: N. Hollinshead

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