The base current and related 1/f noise for SiGe HBTs realized by SEG/NSEG technology on SOI and bulk substrates
The base current and related 1/f noise for SiGe HBTs realized by SEG/NSEG technology on SOI and bulk substrates
It is shown that the high base current and associated low-frequency noise typical for the SiGe HBTs prepared by the selective epitaxial growth of the collector and non-selective epitaxial growth of the base and emitter (SEG/NSEG technology), can be related to the mechanical stress between the collector and the field oxide surrounding the collector in these devices. The reason is that such stress provokes the viscous flow of the surface oxide producing an “action-at-distance” effect which results in the creation of additional fast and slow surface centers at the single crystal emitter and passivating oxide interface and in the oxide, respectively. The increase of fast center density increases the recombination base current component while the increase of slow center density increases the intensity of the 1/f noise source. As a result, any factor that promotes the reduction of the stress or the decrease of the intensity of the surface oxide viscous flow serves to decrease the base current and its 1/f noise. Thus we have found that we can mitigate the undesirable effects by the following solutions: increasing the temperature of the selective epitaxial growth of the collector TSEG, decreasing the temperature of the rapid thermal activation TRTA, implantation of BF2 into the field oxide before the collector and base layers are grown, replacement of the bulk substrate by SOI. It is shown that the maximal decreases of the base current IB and of the spectral density of the 1/f noise SIB are as high as factors of 30 and 8,000, respectively. Therefore, the technology conditions have been identified to guarantee a sufficiently low level of both excess base current noise and base current.
727-731
Lukyanchikova, N.
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Garbar, N.
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Smolanka, A.
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Lokshin, M.
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Hall, S.
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Buiu, O.
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Mitrovic, I.Z.
a1d3f694-b084-42b4-ac61-25a540be3e64
El Mubarek, H.A.W.
08195505-5e00-40a6-bc9f-ebbf2a2fbf63
Ashburn, P.
68cef6b7-205b-47aa-9efb-f1f09f5c1038
April 2006
Lukyanchikova, N.
42c8ec0a-a85a-4a7e-97e4-7b39c5ed19d9
Garbar, N.
445f1a7e-e4a7-4628-83e0-dcca724b345d
Smolanka, A.
c82ee02a-a77b-4351-9baa-5f906ce822f5
Lokshin, M.
08d4d26a-aff2-4044-897b-90b6aff52781
Hall, S.
a11a8f8b-d6fb-47a7-82b1-1f76d2f170dc
Buiu, O.
a994b22e-018b-4355-abd5-0227724f2a1a
Mitrovic, I.Z.
a1d3f694-b084-42b4-ac61-25a540be3e64
El Mubarek, H.A.W.
08195505-5e00-40a6-bc9f-ebbf2a2fbf63
Ashburn, P.
68cef6b7-205b-47aa-9efb-f1f09f5c1038
Lukyanchikova, N., Garbar, N., Smolanka, A., Lokshin, M., Hall, S., Buiu, O., Mitrovic, I.Z., El Mubarek, H.A.W. and Ashburn, P.
(2006)
The base current and related 1/f noise for SiGe HBTs realized by SEG/NSEG technology on SOI and bulk substrates.
Materials Science in Semiconductor Processing, 9 (4), .
Abstract
It is shown that the high base current and associated low-frequency noise typical for the SiGe HBTs prepared by the selective epitaxial growth of the collector and non-selective epitaxial growth of the base and emitter (SEG/NSEG technology), can be related to the mechanical stress between the collector and the field oxide surrounding the collector in these devices. The reason is that such stress provokes the viscous flow of the surface oxide producing an “action-at-distance” effect which results in the creation of additional fast and slow surface centers at the single crystal emitter and passivating oxide interface and in the oxide, respectively. The increase of fast center density increases the recombination base current component while the increase of slow center density increases the intensity of the 1/f noise source. As a result, any factor that promotes the reduction of the stress or the decrease of the intensity of the surface oxide viscous flow serves to decrease the base current and its 1/f noise. Thus we have found that we can mitigate the undesirable effects by the following solutions: increasing the temperature of the selective epitaxial growth of the collector TSEG, decreasing the temperature of the rapid thermal activation TRTA, implantation of BF2 into the field oxide before the collector and base layers are grown, replacement of the bulk substrate by SOI. It is shown that the maximal decreases of the base current IB and of the spectral density of the 1/f noise SIB are as high as factors of 30 and 8,000, respectively. Therefore, the technology conditions have been identified to guarantee a sufficiently low level of both excess base current noise and base current.
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Published date: April 2006
Organisations:
Nanoelectronics and Nanotechnology
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Local EPrints ID: 263312
URI: http://eprints.soton.ac.uk/id/eprint/263312
PURE UUID: 188c1a72-c6a3-47d1-b37c-3499e24cc7f5
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Date deposited: 12 Jan 2007
Last modified: 08 Jan 2022 11:51
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Author:
N. Lukyanchikova
Author:
N. Garbar
Author:
A. Smolanka
Author:
M. Lokshin
Author:
S. Hall
Author:
O. Buiu
Author:
I.Z. Mitrovic
Author:
H.A.W. El Mubarek
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