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Next Generation of 100-μm-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package

Tay, Andrew, Iyer, Mahadevan, Tummala, Rao, Kripesh, V, Wong, E.H., Swaminathan, Madhavan, Wong, C.P., Rotaru, Mihai D., Doraiswami, Ravi and Ang, Simon (2004) Next Generation of 100-μm-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package IEEE Transactions on Advanced Packaging, Vol 27, (No 2), pp. 413-425.

Record type: Article

Abstract

According to the latest ITRS roadmap, the pitch of area array packages is expected to decrease to 100 um by 2009. Simultaneously, the electrical performance of these interconnections needs to be improved to support data rates in excess of 10 Gbps, while guaranteeing thermomechanical reliability and lowering the cost. These requirements are challenging, thus, needing innovative interconnection designs and technologies. This paper describes the development of three interconnection schemes for wafer-level packages (WLPs) at 100-um-pitch, involving rigid, compliant, and semicompliant interconnection technologies, extending the state of the art in each. Extensive electrical and mechanical modeling was carried out to optimize the geometry of the interconnections with respect to electrical performance and thermomechanical reliability. It was found that the requirements of electrical performance often conflict with those of thermomechanical reliability and the final “optimum” design is a tradeoff between the two. For the three interconnection schemes proposed, it was found that the electrical requirements can be met fairly well but acceptable mechanical reliability may require organic boards with coefficient of thermal expansion of 10 ppm/K or lower.

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More information

Published date: May 2004
Keywords: high speed electronic packaging, wafer level packaging.
Organisations: EEE

Identifiers

Local EPrints ID: 264133
URI: http://eprints.soton.ac.uk/id/eprint/264133
PURE UUID: 544232e9-8584-4c94-8581-94c41b4c817e

Catalogue record

Date deposited: 08 Jun 2007
Last modified: 17 Aug 2017 16:35

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Contributors

Author: Andrew Tay
Author: Mahadevan Iyer
Author: Rao Tummala
Author: V Kripesh
Author: E.H. Wong
Author: Madhavan Swaminathan
Author: C.P. Wong
Author: Mihai D. Rotaru
Author: Ravi Doraiswami
Author: Simon Ang

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