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Assessment of the impact of joint bays on the ampacity of high voltage cable circuits

Assessment of the impact of joint bays on the ampacity of high voltage cable circuits
Assessment of the impact of joint bays on the ampacity of high voltage cable circuits
Improvements in the cost and availability of computational power in recent years has led to numerical techniques such as finite element analysis (FEA) becoming viable for cable rating calculations. Such analysis has previously been completed for the case of directly buried and force cooled cable circuits, but without direct consideration of the joint bay. This paper presents methods by which conductor temperature profiles within joint bays may be obtained through the use of FEA. Results are presented for a number of joint bay configurations common to the UK for both naturally and force cooled installations. Implications of the results on circuit rating practice are discussed, along with the benefits of using tools such as FEA are considered against other existing methods.
0885-8977
1029-1036
Pilgrim, J.A.
4b4f7933-1cd8-474f-bf69-39cefc376ab7
Swaffield, D.J.
a49c59cd-9f76-456a-a948-a479b9a1c154
Lewin, P.L.
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Larsen, S T
5c9181e9-bcc5-41fc-9311-48ae7600d8d3
Payne, D.
9a783127-bf02-4dfd-9a73-501a091a80df
Pilgrim, J.A.
4b4f7933-1cd8-474f-bf69-39cefc376ab7
Swaffield, D.J.
a49c59cd-9f76-456a-a948-a479b9a1c154
Lewin, P.L.
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Larsen, S T
5c9181e9-bcc5-41fc-9311-48ae7600d8d3
Payne, D.
9a783127-bf02-4dfd-9a73-501a091a80df

Pilgrim, J.A., Swaffield, D.J., Lewin, P.L., Larsen, S T and Payne, D. (2009) Assessment of the impact of joint bays on the ampacity of high voltage cable circuits. IEEE Transactions on Power Delivery, 24 (3), 1029-1036.

Record type: Article

Abstract

Improvements in the cost and availability of computational power in recent years has led to numerical techniques such as finite element analysis (FEA) becoming viable for cable rating calculations. Such analysis has previously been completed for the case of directly buried and force cooled cable circuits, but without direct consideration of the joint bay. This paper presents methods by which conductor temperature profiles within joint bays may be obtained through the use of FEA. Results are presented for a number of joint bay configurations common to the UK for both naturally and force cooled installations. Implications of the results on circuit rating practice are discussed, along with the benefits of using tools such as FEA are considered against other existing methods.

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Published date: 1 July 2009
Organisations: Electronics & Computer Science, EEE

Identifiers

Local EPrints ID: 267016
URI: http://eprints.soton.ac.uk/id/eprint/267016
ISSN: 0885-8977
PURE UUID: c512d7a8-70a7-46d5-a49a-9aa849a376cb
ORCID for J.A. Pilgrim: ORCID iD orcid.org/0000-0002-2444-2116

Catalogue record

Date deposited: 06 Jan 2009 11:43
Last modified: 21 Nov 2021 02:57

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Contributors

Author: J.A. Pilgrim ORCID iD
Author: D.J. Swaffield
Author: P.L. Lewin
Author: S T Larsen
Author: D. Payne

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