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Use of finite element analysis to obtain thermal ratings for high voltage cable joint bays

Use of finite element analysis to obtain thermal ratings for high voltage cable joint bays
Use of finite element analysis to obtain thermal ratings for high voltage cable joint bays
Recent computational advances have increased the viability of using numerical modelling techniques such as finite element analysis (FEA) to compute the rating of cable circuits. Such analysis has previously been completed for directly buried and force cooled cable circuits, but without direct consideration of the joint bay. In previously presented work a 2D axially symmetric finite element model of a 400kV straight joint was created, allowing for a sensitivity analysis of the model parameters to be performed. Modelling has been subsequently expanded into 3D to allow the calculation of the temperature profile within a 3 phase circuit force cooled cable joint bay. This paper presents a discussion of results obtained from a model of the force cooled cable joint bay and the implications on the circuit rating.
978-1-4244-3917-1
224-227
Pilgrim, J.A.
4b4f7933-1cd8-474f-bf69-39cefc376ab7
Swaffield, D.J.
a49c59cd-9f76-456a-a948-a479b9a1c154
Lewin, P.L.
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Larsen, S T
5c9181e9-bcc5-41fc-9311-48ae7600d8d3
Payne, D.
9a783127-bf02-4dfd-9a73-501a091a80df
Pilgrim, J.A.
4b4f7933-1cd8-474f-bf69-39cefc376ab7
Swaffield, D.J.
a49c59cd-9f76-456a-a948-a479b9a1c154
Lewin, P.L.
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Larsen, S T
5c9181e9-bcc5-41fc-9311-48ae7600d8d3
Payne, D.
9a783127-bf02-4dfd-9a73-501a091a80df

Pilgrim, J.A., Swaffield, D.J., Lewin, P.L., Larsen, S T and Payne, D. (2009) Use of finite element analysis to obtain thermal ratings for high voltage cable joint bays. 2009 IEEE Electrical Insulation Conference, Montreal, Canada. 30 May - 02 Jun 2009. pp. 224-227 .

Record type: Conference or Workshop Item (Paper)

Abstract

Recent computational advances have increased the viability of using numerical modelling techniques such as finite element analysis (FEA) to compute the rating of cable circuits. Such analysis has previously been completed for directly buried and force cooled cable circuits, but without direct consideration of the joint bay. In previously presented work a 2D axially symmetric finite element model of a 400kV straight joint was created, allowing for a sensitivity analysis of the model parameters to be performed. Modelling has been subsequently expanded into 3D to allow the calculation of the temperature profile within a 3 phase circuit force cooled cable joint bay. This paper presents a discussion of results obtained from a model of the force cooled cable joint bay and the implications on the circuit rating.

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More information

Published date: 31 May 2009
Additional Information: Event Dates: 31 May - 3 June 2009
Venue - Dates: 2009 IEEE Electrical Insulation Conference, Montreal, Canada, 2009-05-30 - 2009-06-02
Organisations: Electronics & Computer Science, EEE

Identifiers

Local EPrints ID: 267560
URI: http://eprints.soton.ac.uk/id/eprint/267560
ISBN: 978-1-4244-3917-1
PURE UUID: 59361343-f701-4dc0-937c-4448de39b5a4
ORCID for J.A. Pilgrim: ORCID iD orcid.org/0000-0002-2444-2116

Catalogue record

Date deposited: 12 Jun 2009 16:12
Last modified: 21 Nov 2021 02:57

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Contributors

Author: J.A. Pilgrim ORCID iD
Author: D.J. Swaffield
Author: P.L. Lewin
Author: S T Larsen
Author: D. Payne

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