Smorodin, T., Bohm, C., Gaspar, J., Schmidt, M., Paul, O. and Stecher, M.
Modeling and improvement of a metallization system subjected to fast temperature cycle stress
At Proc. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems EuroSimE 2008.
Full text not available from this repository.
The device failure of DMOS transistors under repetitive inductive load switching is dominated by the thermomechanical deformation of the metallization. The failure evolution is thus experimentally studied with special test structures and highlighted by thermomechanical FEM-simulation. Based on these findings a novel metallization concept is shown, which improves the fast temperature cycle reliability.
Conference or Workshop Item
|Venue - Dates:
||Proc. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems EuroSimE 2008, 2008-01-01
||MOS integrated circuits, finite element analysis, integrated circuit reliability, semiconductor device metallisation, transistors, DMOS transistors, fast temperature cycle stress, metallization system, repetitive inductive load switching, temperature cycle reliability, thermomechanical FEM-simulation, thermomechanical deformation
||Electronics & Computer Science
||25 Nov 2009 13:27
||17 Apr 2017 18:37
|Further Information:||Google Scholar|
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