Dissado, L, Laurent, C, Montanari, GC, Shimizu, N, Fothergill, J, Lewin, P L, Sekii, Y, Nelson, K, Densley, J, Morshuis, P, Rowland, S, Gerhard, R, Okamoto, T, Arnold, M, Stevens, G, Vaughan, A, Fukunaga, K, Chen, G, da Silva, E, Fouracre, T and Holboll, JT (2008) An open letter to members of the IEEE Dielectrics and Electrical Insulation Society. IEEE Electrical Insulation Magazine, 24, 4-4.
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Published date: 2008
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Imported from ISI Web of Science
Organisations:
Electronics & Computer Science, EEE
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Local EPrints ID: 269577
URI: http://eprints.soton.ac.uk/id/eprint/269577
ISSN: 0883-7554
PURE UUID: d28c370a-345c-4c3b-ac88-75c8a2e1a017
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Date deposited: 21 Apr 2010 07:46
Last modified: 15 Mar 2024 03:05
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Contributors
Author:
L Dissado
Author:
C Laurent
Author:
GC Montanari
Author:
N Shimizu
Author:
J Fothergill
Author:
P L Lewin
Author:
Y Sekii
Author:
K Nelson
Author:
J Densley
Author:
P Morshuis
Author:
S Rowland
Author:
R Gerhard
Author:
T Okamoto
Author:
M Arnold
Author:
G Stevens
Author:
A Vaughan
Author:
K Fukunaga
Author:
G Chen
Author:
E da Silva
Author:
T Fouracre
Author:
JT Holboll
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