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An open letter to members of the IEEE Dielectrics and Electrical Insulation Society

An open letter to members of the IEEE Dielectrics and Electrical Insulation Society
An open letter to members of the IEEE Dielectrics and Electrical Insulation Society
0883-7554
4-4
Dissado, L
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Laurent, C
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Montanari, GC
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Shimizu, N
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Fothergill, J
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Lewin, P L
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Sekii, Y
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Nelson, K
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Densley, J
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Morshuis, P
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Rowland, S
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Gerhard, R
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Okamoto, T
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Arnold, M
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Stevens, G
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Vaughan, A
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Fukunaga, K
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Chen, G
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da Silva, E
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Fouracre, T
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Holboll, JT
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Dissado, L
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Laurent, C
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Montanari, GC
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Shimizu, N
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Fothergill, J
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Lewin, P L
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Sekii, Y
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Nelson, K
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Densley, J
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Morshuis, P
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Rowland, S
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Gerhard, R
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Okamoto, T
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Arnold, M
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Stevens, G
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Vaughan, A
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Fukunaga, K
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Chen, G
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da Silva, E
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Fouracre, T
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Holboll, JT
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Dissado, L, Laurent, C, Montanari, GC, Shimizu, N, Fothergill, J, Lewin, P L, Sekii, Y, Nelson, K, Densley, J, Morshuis, P, Rowland, S, Gerhard, R, Okamoto, T, Arnold, M, Stevens, G, Vaughan, A, Fukunaga, K, Chen, G, da Silva, E, Fouracre, T and Holboll, JT (2008) An open letter to members of the IEEE Dielectrics and Electrical Insulation Society. IEEE Electrical Insulation Magazine, 24, 4-4.

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Published date: 2008
Additional Information: Imported from ISI Web of Science
Organisations: Electronics & Computer Science, EEE

Identifiers

Local EPrints ID: 269577
URI: https://eprints.soton.ac.uk/id/eprint/269577
ISSN: 0883-7554
PURE UUID: d28c370a-345c-4c3b-ac88-75c8a2e1a017
ORCID for A Vaughan: ORCID iD orcid.org/0000-0002-0535-513X

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Date deposited: 21 Apr 2010 07:46
Last modified: 20 Jul 2019 01:07

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Contributors

Author: L Dissado
Author: C Laurent
Author: GC Montanari
Author: N Shimizu
Author: J Fothergill
Author: P L Lewin
Author: Y Sekii
Author: K Nelson
Author: J Densley
Author: P Morshuis
Author: S Rowland
Author: R Gerhard
Author: T Okamoto
Author: M Arnold
Author: G Stevens
Author: A Vaughan ORCID iD
Author: K Fukunaga
Author: G Chen
Author: E da Silva
Author: T Fouracre
Author: JT Holboll

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