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An open letter to members of the IEEE Dielectrics and Electrical Insulation Society

Dissado, L, Laurent, C, Montanari, GC, Shimizu, N, Fothergill, J, Lewin, P L, Sekii, Y, Nelson, K, Densley, J, Morshuis, P, Rowland, S, Gerhard, R, Okamoto, T, Arnold, M, Stevens, G, Vaughan, A, Fukunaga, K, Chen, G, da Silva, E, Fouracre, T and Holboll, JT (2008) An open letter to members of the IEEE Dielectrics and Electrical Insulation Society IEEE Electrical Insulation Magazine, 24, p. 4.

Record type: Article
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Published date: 2008
Additional Information: Imported from ISI Web of Science
Organisations: Electronics & Computer Science, EEE


Local EPrints ID: 269577
ISSN: 0883-7554
PURE UUID: d28c370a-345c-4c3b-ac88-75c8a2e1a017

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Date deposited: 21 Apr 2010 07:46
Last modified: 18 Jul 2017 06:51

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Author: L Dissado
Author: C Laurent
Author: GC Montanari
Author: N Shimizu
Author: J Fothergill
Author: P L Lewin
Author: Y Sekii
Author: K Nelson
Author: J Densley
Author: P Morshuis
Author: S Rowland
Author: R Gerhard
Author: T Okamoto
Author: M Arnold
Author: G Stevens
Author: A Vaughan
Author: K Fukunaga
Author: G Chen
Author: E da Silva
Author: T Fouracre
Author: JT Holboll

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