An open letter to members of the IEEE Dielectrics and Electrical Insulation Society


Dissado, L, Laurent, C, Montanari, GC, Shimizu, N, Fothergill, J, Lewin, P L, Sekii, Y, Nelson, K, Densley, J, Morshuis, P, Rowland, S, Gerhard, R, Okamoto, T, Arnold, M, Stevens, G, Vaughan, A, Fukunaga, K, Chen, G, da Silva, E, Fouracre, T and Holboll, JT (2008) An open letter to members of the IEEE Dielectrics and Electrical Insulation Society IEEE Electrical Insulation Magazine, 24, p. 4.

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Item Type: Article
Additional Information: Imported from ISI Web of Science
ISSNs: 0883-7554 (print)
Organisations: Electronics & Computer Science, EEE
ePrint ID: 269577
Date :
Date Event
2008Published
Date Deposited: 21 Apr 2010 07:46
Last Modified: 17 Apr 2017 18:29
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/269577

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