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Fabrication of MEMS components using ultra fine grained aluminium

Fabrication of MEMS components using ultra fine grained aluminium
Fabrication of MEMS components using ultra fine grained aluminium
A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands
0960-1317
45029
Qiao, X.
6df67c97-457c-47e5-a541-6a1316179522
Gao, N.
9c1370f7-f4a9-4109-8a3a-4089b3baec21
Moktadir, Zakaria
34472668-ffda-4287-8fea-2c4f3bf1e2fa
Michael, Kraft
54927621-738f-4d40-af56-a027f686b59f
Starink, M.J.
fe61a323-4e0c-49c7-91f0-4450e1ec1e51
Qiao, X.
6df67c97-457c-47e5-a541-6a1316179522
Gao, N.
9c1370f7-f4a9-4109-8a3a-4089b3baec21
Moktadir, Zakaria
34472668-ffda-4287-8fea-2c4f3bf1e2fa
Michael, Kraft
54927621-738f-4d40-af56-a027f686b59f
Starink, M.J.
fe61a323-4e0c-49c7-91f0-4450e1ec1e51

Qiao, X., Gao, N., Moktadir, Zakaria, Michael, Kraft and Starink, M.J. (2010) Fabrication of MEMS components using ultra fine grained aluminium. Journal of Micromechanics and Microengineering, 20 (4), 45029. (doi:10.1088/0960-1317/20/4/045029).

Record type: Article

Abstract

A novel process for the fabrication of a microelectromechanical systems (MEMS) metallic component with features smaller than 10 µm and high thermal conductivity was investigated. This may be applied to new or improved microscale components, such as (micro-) heat exchangers. In the first stage of processing, equal channel angular pressing (ECAP) was employed to refine the grain size of commercial purity aluminium (Al-1050) to the ultrafine-grained (UFG) material. Embossing was conducted using a micro silicon mould fabricated by deep reactive ion etching (DRIE). Both cold embossing and hot embossing were performed on the coarse-grained and UFG Al-1050. Cold embossing on UFG Al-1050 led to a partially transferred pattern from the micro silicon mould and high failure rate of the mould. Hot embossing on UFG Al-1050 provided a smooth embossed surface with a fully transferred pattern and a low failure rate of the mould, while hot embossing on the coarse-grained Al-1050 resulted in a rougher surface with shear bands

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Published date: 2010
Organisations: Nanoelectronics and Nanotechnology

Identifiers

Local EPrints ID: 270883
URI: http://eprints.soton.ac.uk/id/eprint/270883
ISSN: 0960-1317
PURE UUID: 9053e4f4-7f6d-482c-badc-0603188d0af4

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Date deposited: 21 Apr 2010 10:18
Last modified: 30 Sep 2019 19:11

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