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Novel surface potential decay of TiO2-based polyimide nanocomposite films

Zha, J, Chen, G, Zhuang, Y and Dang, Z (2010) Novel surface potential decay of TiO2-based polyimide nanocomposite films At 2010 Conference on Electrical Insulation and Dielectric Phenomena, United States. 17 - 20 Oct 2010. , pp. 26-29.

Record type: Conference or Workshop Item (Paper)


Polymer nanocomposites have attracted wide interest as a method of enhancing polymer properties and extending their applications. Surface potential decay has been used widely as a tool to monitor charge transport and trapping characteristics of insulating materials. Polyimide (PI) as an engineering material has been paid more attention due to high thermal and chemical stability, good mechanical property and excellent insulating property in a wide range of temperature. There has been a lot of work over last few years on optical, thermal and mechanical properties of polyimide nanocomposites. However, less attention has been given to the effect of nano-fillers on charge transport and trapping in polyimide nanocomposites. In the present paper the surface potential decay after dc corona charging of PI nanocomposites has been studied. Polyimide nanocomposite films containing surface modified nano-particles by employing silane coupling agent were prepared by using insitu dispersion polymerization process. The surface potential decay measurements on both pure PI film and PI nanocomposite films were investigated over the different corona-charged times and charging voltages in a controlled environment where temperature and relative humidity were kept at 21 0C and 45%, respectively. It has been found that there is a significant change in the surface potential decay characteristics after nanofillers were introduced into polyimide. The surface potential decay pattern depends also on the amount of nano-fillers. The possible surface potential decay mechanisms responsible for the observed phenomena were discussed.

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Published date: 17 October 2010
Additional Information: Event Dates: 17 - 20 October 2010
Venue - Dates: 2010 Conference on Electrical Insulation and Dielectric Phenomena, United States, 2010-10-17 - 2010-10-20
Organisations: Electronics & Computer Science, EEE


Local EPrints ID: 271635
PURE UUID: e9669939-c955-4660-96b6-60bf99a05a4a

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Date deposited: 18 Oct 2010 19:39
Last modified: 18 Jul 2017 06:40

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Author: J Zha
Author: G Chen
Author: Y Zhuang
Author: Z Dang

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