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Effect of Nano-Fillers on Electrical Breakdown Behavior of Epoxy Resin

Record type: Conference or Workshop Item (Paper)

Epoxy resin is widely used in high voltage apparatus as insulation due to its excellent mechanical, electrical and chemical properties. In recent years, researches on epoxy resin/nanocomposites have shown that the presence of nano-size filler in epoxy resin system can improve electrical, thermal and mechanical properties significantly. In the present paper, the epoxy resin containing nanosize SiO2 and Al2O3 fillers were prepared and the influence of nanosize filler on nanocomposites electrical properties was investigated. The epoxy resin (LY556), commonly used in power apparatus, was used as the base material and nano-sized fillers were mechanically mixed into the epoxy resin. The influence of filler type, filler size and filler concentration on nanocomposites ac breakdown strength and space charge accumulation were examined. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the results were compared with those obtained from epoxy resin/nanocomposites. The present results show that the presence of nano-sized fillers affects space charge accumulation and ac breakdown strength shows a slight reduction. The dielectric properties are strongly influenced by the filler size type and concentration.

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Citation

Wang, Q, Curtis, P and Chen, G (2010) Effect of Nano-Fillers on Electrical Breakdown Behavior of Epoxy Resin At 2010 Conference on Electrical Insulation and Dielectric Phenomena, United States. 17 - 20 Oct 2010. , pp. 393-396.

More information

Published date: 17 October 2010
Additional Information: Event Dates: 17 - 20 October 2010
Venue - Dates: 2010 Conference on Electrical Insulation and Dielectric Phenomena, United States, 2010-10-17 - 2010-10-20
Organisations: Electronics & Computer Science, EEE

Identifiers

Local EPrints ID: 271643
URI: http://eprints.soton.ac.uk/id/eprint/271643
PURE UUID: 2bc45eac-1c2b-4b18-a459-9d0faf75cdcb

Catalogue record

Date deposited: 20 Oct 2010 13:13
Last modified: 18 Jul 2017 06:40

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Contributors

Author: Q Wang
Author: P Curtis
Author: G Chen

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