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Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System

Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System
Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System
Epoxy resin and its composites filled with microsized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.
302-305
Nguyen, V
f0c0837a-052c-4a30-b64e-c607e49247a6
Vaughan, A S
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Lewin, P L
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Krivda, A
73f11276-1939-4036-893c-e32deb7eb80c
Nguyen, V
f0c0837a-052c-4a30-b64e-c607e49247a6
Vaughan, A S
6d813b66-17f9-4864-9763-25a6d659d8a3
Lewin, P L
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Krivda, A
73f11276-1939-4036-893c-e32deb7eb80c

Nguyen, V, Vaughan, A S, Lewin, P L and Krivda, A (2011) Stoichiometry and Effects of Nano-sized and Micro-sized Fillers on an Epoxy Based System. 2011 Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico. 15 - 18 Oct 2011. pp. 302-305 .

Record type: Conference or Workshop Item (Paper)

Abstract

Epoxy resin and its composites filled with microsized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.

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More information

Published date: 16 October 2011
Additional Information: Event Dates: 16-19 October 2011
Venue - Dates: 2011 Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico, 2011-10-15 - 2011-10-18
Organisations: Electronics & Computer Science, EEE

Identifiers

Local EPrints ID: 272944
URI: http://eprints.soton.ac.uk/id/eprint/272944
PURE UUID: dadd2b45-45dc-4b84-af52-aaf3e72ce3ed
ORCID for A S Vaughan: ORCID iD orcid.org/0000-0002-0535-513X
ORCID for P L Lewin: ORCID iD orcid.org/0000-0002-3299-2556

Catalogue record

Date deposited: 20 Oct 2011 14:08
Last modified: 03 Dec 2021 02:35

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Contributors

Author: V Nguyen
Author: A S Vaughan ORCID iD
Author: P L Lewin ORCID iD
Author: A Krivda

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