An investigation into improving the breakdown strength and thermal conduction of an epoxy system using boron nitride
An investigation into improving the breakdown strength and thermal conduction of an epoxy system using boron nitride
It has been seen previously that addition of fillers to host material systems can create composites with superior properties. In particular polymers have been shown to be good hosts for such property-boosting fillers. This investigation looks at such a polymer based nanocomposite, with the aim to produce a thermally conductive high voltage insulator. A standard thermosetting epoxy system and hardener were chosen to act as the host polymer due to its good initial mechanical and electrical properties. This system has also been successfully used previously to host other fillers. The filler chosen was boron nitride powder, due to its claim of having good insulation properties and high thermal conductivity. Several different sizes and aggregation states of boron nitride were tested and it was hoped that successful dispersion of the fillers would not only increase the breakdown strength of the material, but also the thermal conductivity.
636-639
Reading, M D
3e31718a-7f7f-4e3c-8267-5cf7bc66c38f
Vaughan, A S
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Lewin, P L
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
16 October 2011
Reading, M D
3e31718a-7f7f-4e3c-8267-5cf7bc66c38f
Vaughan, A S
6d813b66-17f9-4864-9763-25a6d659d8a3
Lewin, P L
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Reading, M D, Vaughan, A S and Lewin, P L
(2011)
An investigation into improving the breakdown strength and thermal conduction of an epoxy system using boron nitride.
2011 Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico.
16 - 19 Oct 2011.
.
Record type:
Conference or Workshop Item
(Paper)
Abstract
It has been seen previously that addition of fillers to host material systems can create composites with superior properties. In particular polymers have been shown to be good hosts for such property-boosting fillers. This investigation looks at such a polymer based nanocomposite, with the aim to produce a thermally conductive high voltage insulator. A standard thermosetting epoxy system and hardener were chosen to act as the host polymer due to its good initial mechanical and electrical properties. This system has also been successfully used previously to host other fillers. The filler chosen was boron nitride powder, due to its claim of having good insulation properties and high thermal conductivity. Several different sizes and aggregation states of boron nitride were tested and it was hoped that successful dispersion of the fillers would not only increase the breakdown strength of the material, but also the thermal conductivity.
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Published date: 16 October 2011
Additional Information:
Event Dates: 16-19 October 2011
Venue - Dates:
2011 Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico, 2011-10-16 - 2011-10-19
Organisations:
Electronics & Computer Science, EEE
Identifiers
Local EPrints ID: 272949
URI: http://eprints.soton.ac.uk/id/eprint/272949
PURE UUID: f1fe8542-4744-4288-9693-5ad4fb9cac86
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Date deposited: 20 Oct 2011 14:46
Last modified: 15 Mar 2024 03:05
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Contributors
Author:
M D Reading
Author:
A S Vaughan
Author:
P L Lewin
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