Dielectric and thermal properties of boron nitride and silica epoxy composites
Dielectric and thermal properties of boron nitride and silica epoxy composites
Samples containing only submicrometric filler (BN), only nanometric filler (Silica) and both fillers were prepared by gravity moulding. A pure epoxy sample was also prepared to quantify the enhanced properties. Glass transition temperatures were measured by Differential Scanning Calorimetry. Dielectric Breakdown data were analysed using the Weibull statistical method and Dielectric Spectroscopy was used at low and high voltage to measure the samples permittivity. The glass transition temperature is decreased by BN presence but not by nanosilica. At ambient temperature, the ? relaxation peak is not affected by nanoparticles nor by applied voltage. Strangely, the sample containing the two nanoparticles type is not affected compared to pure epoxy. On dielectric spectra, a supplementary relaxation peak for samples containing nanosilica is present. This peak is associated with the interphase between nanosilica and polymer.
component, nanodielectrics, high voltage, dielectric
spectroscopy, glass transition temperature
Couderc, H.
e87cc776-5052-43d2-9d97-63bc2eb1168b
Frechette, M.
61d2d4dd-d1c9-4aaf-a8dc-9ed48e96aeae
Savoie, S.
f92c56c2-bb17-4b9d-990b-cb3ebfe3aaf7
Reading, M.D.
a7fd3777-cba5-420a-8ca1-9511448a1609
Vaughan, A.S.
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10 June 2012
Couderc, H.
e87cc776-5052-43d2-9d97-63bc2eb1168b
Frechette, M.
61d2d4dd-d1c9-4aaf-a8dc-9ed48e96aeae
Savoie, S.
f92c56c2-bb17-4b9d-990b-cb3ebfe3aaf7
Reading, M.D.
a7fd3777-cba5-420a-8ca1-9511448a1609
Vaughan, A.S.
6d813b66-17f9-4864-9763-25a6d659d8a3
Couderc, H., Frechette, M., Savoie, S., Reading, M.D. and Vaughan, A.S.
(2012)
Dielectric and thermal properties of boron nitride and silica epoxy composites.
IEEE 2012 International Symposium on Electrical Insulation, San Juan, Puerto Rico.
10 - 13 Jun 2012.
5 pp
.
Record type:
Conference or Workshop Item
(Paper)
Abstract
Samples containing only submicrometric filler (BN), only nanometric filler (Silica) and both fillers were prepared by gravity moulding. A pure epoxy sample was also prepared to quantify the enhanced properties. Glass transition temperatures were measured by Differential Scanning Calorimetry. Dielectric Breakdown data were analysed using the Weibull statistical method and Dielectric Spectroscopy was used at low and high voltage to measure the samples permittivity. The glass transition temperature is decreased by BN presence but not by nanosilica. At ambient temperature, the ? relaxation peak is not affected by nanoparticles nor by applied voltage. Strangely, the sample containing the two nanoparticles type is not affected compared to pure epoxy. On dielectric spectra, a supplementary relaxation peak for samples containing nanosilica is present. This peak is associated with the interphase between nanosilica and polymer.
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e-pub ahead of print date: June 2012
Published date: 10 June 2012
Venue - Dates:
IEEE 2012 International Symposium on Electrical Insulation, San Juan, Puerto Rico, 2012-06-10 - 2012-06-13
Keywords:
component, nanodielectrics, high voltage, dielectric
spectroscopy, glass transition temperature
Organisations:
EEE
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Local EPrints ID: 340299
URI: http://eprints.soton.ac.uk/id/eprint/340299
PURE UUID: 6899242b-19f1-478d-9398-3e3fc985f214
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Date deposited: 19 Jun 2012 11:26
Last modified: 15 Mar 2024 03:05
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Contributors
Author:
H. Couderc
Author:
M. Frechette
Author:
S. Savoie
Author:
M.D. Reading
Author:
A.S. Vaughan
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