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Nanoscratch behavior of multi-layered films using molecular dynamics

Nanoscratch behavior of multi-layered films using molecular dynamics
Nanoscratch behavior of multi-layered films using molecular dynamics
Molecular dynamics simulations are performed to study the plastic deformation, stress and chip formation of scratched multi-layered films. The results showed that stick–slip and work-hardening behaviors were observed during the scratching process. There was a pile-up of amorphous disordered debris atoms and shear rupture ahead of the probe and a clear side-flow on the lateral sides of the probe when the probe moved forward. Both the plastic energy and the adhesion increased with an increase in the scratching depth. The glide band of the interface was on the {111}?110? slip system with a maximum width of the glide band of about 1 nm. The strain energy stored in the deformed structure caused a higher stress region in the material in front of the tool edge, with a maximum stress of about 10 GPa. In addition, the mechanical response and thermal softness phenomenon are discussed
0947-8396
753-758
Fang, Te-Hua
8ddd64a8-3c9b-4a81-ac30-84fc8c793a59
Liu, Chien-Hung
452bf871-8a3e-4263-89b1-6c8877da549f
Shen, Siu-Tsen
3d7a9237-0668-4ebe-87a5-2725b268fbd3
Prior, Stephen D.
9c753e49-092a-4dc5-b4cd-6d5ff77e9ced
Ji, Liang-Wen
3f4d5ba2-a4a1-436a-a8e0-c7d4c167a5f7
Wu, Jia-Hung
7d6208ee-3095-4bc0-b8d6-b17dc087718c
Fang, Te-Hua
8ddd64a8-3c9b-4a81-ac30-84fc8c793a59
Liu, Chien-Hung
452bf871-8a3e-4263-89b1-6c8877da549f
Shen, Siu-Tsen
3d7a9237-0668-4ebe-87a5-2725b268fbd3
Prior, Stephen D.
9c753e49-092a-4dc5-b4cd-6d5ff77e9ced
Ji, Liang-Wen
3f4d5ba2-a4a1-436a-a8e0-c7d4c167a5f7
Wu, Jia-Hung
7d6208ee-3095-4bc0-b8d6-b17dc087718c

Fang, Te-Hua, Liu, Chien-Hung, Shen, Siu-Tsen, Prior, Stephen D., Ji, Liang-Wen and Wu, Jia-Hung (2008) Nanoscratch behavior of multi-layered films using molecular dynamics. Applied Physics A: Materials Science & Processing, 90 (4), 753-758. (doi:10.1007/s00339-007-4351-8).

Record type: Article

Abstract

Molecular dynamics simulations are performed to study the plastic deformation, stress and chip formation of scratched multi-layered films. The results showed that stick–slip and work-hardening behaviors were observed during the scratching process. There was a pile-up of amorphous disordered debris atoms and shear rupture ahead of the probe and a clear side-flow on the lateral sides of the probe when the probe moved forward. Both the plastic energy and the adhesion increased with an increase in the scratching depth. The glide band of the interface was on the {111}?110? slip system with a maximum width of the glide band of about 1 nm. The strain energy stored in the deformed structure caused a higher stress region in the material in front of the tool edge, with a maximum stress of about 10 GPa. In addition, the mechanical response and thermal softness phenomenon are discussed

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More information

Published date: 2008
Additional Information: Multi-layered film nanostructures have received a lot of attention for applications such as in high-density storage systems, magnetic media, protective coatings and microsystem technologies. This study uses MD simulations to evaluate the processing and mechanical properties of multi-layered films at different temperatures and depths. The effect of the interface of layered films is discussed. In addition, the scratch mechanism, stress distribution and plastic energy of the films are also investigated.
Organisations: Aeronautics, Astronautics & Comp. Eng

Identifiers

Local EPrints ID: 343559
URI: https://eprints.soton.ac.uk/id/eprint/343559
ISSN: 0947-8396
PURE UUID: 298c575d-91bd-4cc3-a543-9a94bf8a879c
ORCID for Stephen D. Prior: ORCID iD orcid.org/0000-0002-4993-4942

Catalogue record

Date deposited: 04 Oct 2012 14:08
Last modified: 20 Jul 2019 00:40

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Contributors

Author: Te-Hua Fang
Author: Chien-Hung Liu
Author: Siu-Tsen Shen
Author: Liang-Wen Ji
Author: Jia-Hung Wu

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