Polyethylene nanodielectrics: the effect of nanosilica and its surface treatment on electrical breakdown strength
Polyethylene nanodielectrics: the effect of nanosilica and its surface treatment on electrical breakdown strength
 
  The topic of polymer nanocomposites remains an active area of research in terms of potential applications for dielectric materials. Although more than a decade has passed since these systems were first considered as dielectric materials, the precise effects of incorporating nanofillers into different polymers are yet to be confirmed. This paper reports on an investigation into the AC and DC breakdown behaviours of nanofilled polyethylene. A blend of low density and high density polyethylene was selected as the matrix while the chosen nanofiller was nanosilica; different nanofiller loading levels (2 wt%, 5 wt% and 10 wt%) and surface chemistries (untreated and silane treated) are discussed. The surface chemistry of the treated materials was characterised by Fourier transform infrared spectroscopy while the lamellar morphology and dispersion state of the final nanocomposites was determined by scanning electron microscopy (SEM). Breakdown results show that the introduction of 2 wt% or 5 wt% of nanosilica does not have a significant effect on the AC breakdown response and that this applies to both the untreated and treated nanosilica. In both cases, the AC breakdown strength was commensurate with that of the unfilled polyethylene. However, where severe clustering occurred, as evinced from SEM micrographs, the AC breakdown strength was found to be reduced significantly. Meanwhile, in DC breakdown testing, increasing the amount of untreated nanosilica was found to reduce the DC breakdown strength of the polyethylene. In contrast, surface treatment of nanosilica increased the DC breakdown strength compared with samples containing equivalent amount of untreated nanosilica
  978-1-4673-1252-3
  21-24
  
    
      Lau, K.Y.
      
        4f20d9d7-c517-4af9-bb57-b4f47538bf68
      
     
  
    
      Vaughan, A.S.
      
        6d813b66-17f9-4864-9763-25a6d659d8a3
      
     
  
    
      Chen, G.
      
        3de45a9c-6c9a-4bcb-90c3-d7e26be21819
      
     
  
    
      Hosier, I.L.
      
        6a44329e-b742-44de-afa7-073f80a78e26
      
     
  
  
   
  
  
    
      14 October 2012
    
    
  
  
    
      Lau, K.Y.
      
        4f20d9d7-c517-4af9-bb57-b4f47538bf68
      
     
  
    
      Vaughan, A.S.
      
        6d813b66-17f9-4864-9763-25a6d659d8a3
      
     
  
    
      Chen, G.
      
        3de45a9c-6c9a-4bcb-90c3-d7e26be21819
      
     
  
    
      Hosier, I.L.
      
        6a44329e-b742-44de-afa7-073f80a78e26
      
     
  
       
    
 
  
    
      
  
  
  
  
    Lau, K.Y., Vaughan, A.S., Chen, G. and Hosier, I.L.
  
  
  
  
   
    (2012)
  
  
    
    Polyethylene nanodielectrics: the effect of nanosilica and its surface treatment on electrical breakdown strength.
  
  
  
  
    
    
    
      
        
   
  
    2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, Montreal, Canada.
   
        
        
        14 - 17  Oct 2012.
      
    
  
  
  
      
          
          
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      Record type:
      Conference or Workshop Item
      (Paper)
      
      
    
   
    
    
      
        
          Abstract
          The topic of polymer nanocomposites remains an active area of research in terms of potential applications for dielectric materials. Although more than a decade has passed since these systems were first considered as dielectric materials, the precise effects of incorporating nanofillers into different polymers are yet to be confirmed. This paper reports on an investigation into the AC and DC breakdown behaviours of nanofilled polyethylene. A blend of low density and high density polyethylene was selected as the matrix while the chosen nanofiller was nanosilica; different nanofiller loading levels (2 wt%, 5 wt% and 10 wt%) and surface chemistries (untreated and silane treated) are discussed. The surface chemistry of the treated materials was characterised by Fourier transform infrared spectroscopy while the lamellar morphology and dispersion state of the final nanocomposites was determined by scanning electron microscopy (SEM). Breakdown results show that the introduction of 2 wt% or 5 wt% of nanosilica does not have a significant effect on the AC breakdown response and that this applies to both the untreated and treated nanosilica. In both cases, the AC breakdown strength was commensurate with that of the unfilled polyethylene. However, where severe clustering occurred, as evinced from SEM micrographs, the AC breakdown strength was found to be reduced significantly. Meanwhile, in DC breakdown testing, increasing the amount of untreated nanosilica was found to reduce the DC breakdown strength of the polyethylene. In contrast, surface treatment of nanosilica increased the DC breakdown strength compared with samples containing equivalent amount of untreated nanosilica
         
      
      
        
          
            
  
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      Published date: 14 October 2012
 
    
  
  
    
  
    
  
    
     
        Venue - Dates:
        2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, Montreal, Canada, 2012-10-14 - 2012-10-17
      
    
  
    
  
    
  
    
  
    
     
        Organisations:
        EEE
      
    
  
    
  
  
  
    
  
  
        Identifiers
        Local EPrints ID: 344277
        URI: http://eprints.soton.ac.uk/id/eprint/344277
        
        
          ISBN: 978-1-4673-1252-3
        
        
        
          PURE UUID: dd42f786-85da-430a-b436-7787f37c7931
        
  
    
        
          
        
    
        
          
            
              
            
          
        
    
        
          
            
          
        
    
        
          
            
              
            
          
        
    
  
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  Date deposited: 17 Oct 2012 13:41
  Last modified: 15 Mar 2024 03:18
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      Contributors
      
          
          Author:
          
            
            
              K.Y. Lau
            
          
        
      
          
          Author:
          
            
              
              
                A.S. Vaughan
              
              
                 
              
            
            
          
         
      
          
          Author:
          
            
              
              
                G. Chen
              
              
            
            
          
        
      
          
          Author:
          
            
              
              
                I.L. Hosier
              
              
                 
              
            
            
          
         
      
      
      
    
  
   
  
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