Dielectric properties of boron nitride and silica epoxy composites
Dielectric properties of boron nitride and silica epoxy composites
Epoxies are widely used materials, especially in high voltage insulation for its mechanical and dielectric properties. Boron Nitride is an attractive filler because of its high insulating properties associated with a high thermal conductivity. Nanometric Silica used as filler is actually widely studied in the literature and enhancement of dielectric breakdown and insulating properties has been shown. Using a combination of these two fillers in an epoxy matrix may produce a new material with improved properties.
Samples containing only micrometric filler (Boron Nitride), only nanometric filler (Silica) and both fillers were prepared by gravity moulding. A pure epoxy sample was also prepared to quantify the enhancement properties. Broadband Dielectric Spectroscopy was used to study the influence of nanoparticles on the relaxation mechanisms in the composites. An additional relaxation peak was highlighted for samples containing nanosilica between the local ? relaxation, associated with crankshaft motions of the hydroxylether groups, and the main ? relaxation, corresponding to glass transition cooperative movements. This relaxation phenomenon was found to be associated with the water bounded at the surface of the silica particles. Further relaxation investigation will be performed to clarify the influence of water, its state and its role
978-1-4673-1252-3
511-516
Couderc, H.
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Preda, I.
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Frechette, M.
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Savoie, S.
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Reading, M.
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Vaughan, A.S.
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Castellon, J.
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14 October 2012
Couderc, H.
e87cc776-5052-43d2-9d97-63bc2eb1168b
Preda, I.
23544560-29b5-41a5-a237-556bd128b1b6
Frechette, M.
61d2d4dd-d1c9-4aaf-a8dc-9ed48e96aeae
Savoie, S.
f92c56c2-bb17-4b9d-990b-cb3ebfe3aaf7
Reading, M.
918aef67-67b3-41c4-af1e-f31c6736a95f
Vaughan, A.S.
6d813b66-17f9-4864-9763-25a6d659d8a3
Castellon, J.
8e8531dc-b356-4044-bbd3-9271458d2525
Couderc, H., Preda, I., Frechette, M., Savoie, S., Reading, M., Vaughan, A.S. and Castellon, J.
(2012)
Dielectric properties of boron nitride and silica epoxy composites.
2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, Montreal, Canada.
14 - 17 Oct 2012.
.
Record type:
Conference or Workshop Item
(Paper)
Abstract
Epoxies are widely used materials, especially in high voltage insulation for its mechanical and dielectric properties. Boron Nitride is an attractive filler because of its high insulating properties associated with a high thermal conductivity. Nanometric Silica used as filler is actually widely studied in the literature and enhancement of dielectric breakdown and insulating properties has been shown. Using a combination of these two fillers in an epoxy matrix may produce a new material with improved properties.
Samples containing only micrometric filler (Boron Nitride), only nanometric filler (Silica) and both fillers were prepared by gravity moulding. A pure epoxy sample was also prepared to quantify the enhancement properties. Broadband Dielectric Spectroscopy was used to study the influence of nanoparticles on the relaxation mechanisms in the composites. An additional relaxation peak was highlighted for samples containing nanosilica between the local ? relaxation, associated with crankshaft motions of the hydroxylether groups, and the main ? relaxation, corresponding to glass transition cooperative movements. This relaxation phenomenon was found to be associated with the water bounded at the surface of the silica particles. Further relaxation investigation will be performed to clarify the influence of water, its state and its role
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Published date: 14 October 2012
Venue - Dates:
2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, Montreal, Canada, 2012-10-14 - 2012-10-17
Organisations:
Physics & Astronomy, EEE
Identifiers
Local EPrints ID: 344316
URI: http://eprints.soton.ac.uk/id/eprint/344316
ISBN: 978-1-4673-1252-3
PURE UUID: 262e3c9b-c7c1-4df8-bf96-85867021f61c
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Date deposited: 18 Oct 2012 10:05
Last modified: 15 Mar 2024 03:05
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Contributors
Author:
H. Couderc
Author:
I. Preda
Author:
M. Frechette
Author:
S. Savoie
Author:
M. Reading
Author:
A.S. Vaughan
Author:
J. Castellon
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