Synthesis and dielectric properties of epoxy based nanocomposites
Synthesis and dielectric properties of epoxy based nanocomposites
Insulation based on epoxy resin is widely used in high voltage applications. This paper shows the formulation of epoxy based nanocomposites and the influence of the filler material on the DC breakdown strength. Filler materials discussed are SiO2, Al2O3 and AlN with average particle size between 22 and 100 nm. AlN has been chosen because it has shown to considerably increase the thermal conductivity of epoxy resin. SiO2 and Al2O3 are widely used as filler for electrical applications since they improve mechanical, thermal and electrical properties, beside neat epoxy samples, which have been used as reference. Base material for all samples is conventional bisphenol-A type epoxy resin with anhydrite hardener. Particle size and dispersion within the epoxy matrix have been validated via transmission electron microscopy. Breakdown measurements have been performed by means of DC ramp tests. Results of nano-Al2O3 samples have also been compared with surface functionalized microscale filler.
978-1-4244-4559-2
523-526
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Gebrekiros, Y.T.
765a88e4-de87-4f76-b65a-30c7d35d201c
Lafont, U.
384b46f6-42e7-42ed-a011-56081e5d6c85
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
October 2009
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Gebrekiros, Y.T.
765a88e4-de87-4f76-b65a-30c7d35d201c
Lafont, U.
384b46f6-42e7-42ed-a011-56081e5d6c85
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
Andritsch, T., Kochetov, R., Gebrekiros, Y.T., Lafont, U., Morshuis, P.H.F. and Smit, J.J.
(2009)
Synthesis and dielectric properties of epoxy based nanocomposites.
IEEE Conference on Electrical Insulation and Dielectric Phenomena, 2009, , Virginia Beach, United States.
18 - 21 Oct 2009.
.
(doi:10.1109/CEIDP.2009.5377771).
Record type:
Conference or Workshop Item
(Paper)
Abstract
Insulation based on epoxy resin is widely used in high voltage applications. This paper shows the formulation of epoxy based nanocomposites and the influence of the filler material on the DC breakdown strength. Filler materials discussed are SiO2, Al2O3 and AlN with average particle size between 22 and 100 nm. AlN has been chosen because it has shown to considerably increase the thermal conductivity of epoxy resin. SiO2 and Al2O3 are widely used as filler for electrical applications since they improve mechanical, thermal and electrical properties, beside neat epoxy samples, which have been used as reference. Base material for all samples is conventional bisphenol-A type epoxy resin with anhydrite hardener. Particle size and dispersion within the epoxy matrix have been validated via transmission electron microscopy. Breakdown measurements have been performed by means of DC ramp tests. Results of nano-Al2O3 samples have also been compared with surface functionalized microscale filler.
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Published date: October 2009
Venue - Dates:
IEEE Conference on Electrical Insulation and Dielectric Phenomena, 2009, , Virginia Beach, United States, 2009-10-18 - 2009-10-21
Organisations:
EEE
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Local EPrints ID: 354453
URI: http://eprints.soton.ac.uk/id/eprint/354453
ISBN: 978-1-4244-4559-2
PURE UUID: d634cfab-3d04-465d-886c-ca3c9bbe8945
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Date deposited: 30 Jul 2013 10:18
Last modified: 15 Mar 2024 03:48
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Author:
T. Andritsch
Author:
R. Kochetov
Author:
Y.T. Gebrekiros
Author:
U. Lafont
Author:
P.H.F. Morshuis
Author:
J.J. Smit
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