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Short term DC breakdown strength in epoxy based BN nano- and microcomposites

Short term DC breakdown strength in epoxy based BN nano- and microcomposites
Short term DC breakdown strength in epoxy based BN nano- and microcomposites
Nanocomposites have been known in the field of electrical engineering for more than a decade, albeit there are still uncertainties of how the filler properties influence the properties of the composite material. Filler size, shape, aspect ratio and the surface modification, which consequently leads to even dispersion or clusters of particles, are all suspected to influence the dielectric behaviour of the insulation. But it is disputed what influences the properties to what extent. The focus of this paper is the dependence of the short term breakdown (BD) strength of polymer based composites filled with boron nitride (BN) on the filler size. Base polymer is commercially available bisphenol A epoxy with anhydrite hardener. As filler material we use boron nitride powder with different average particle sizes. These are ranging from 70 to 5000 nm. The particles were not surface modified in order to see solely the influence of the filler size on the BD strength. The short term BD strength was measured for negative DC voltages with Rogowski shaped electrodes. Dielectric spectroscopy was done complementarily to see how the filler size influences the relative permittivity of the composites.
978-1-4244-7943-6
1-4
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Kochetov, Roman
9132fe00-0536-4082-a4ce-54253b2e9fe0
Gebrekiros, Yonas T.
626fd6b9-e1a6-4a4f-9ded-7b61e81d6473
Morshuis, Peter H.F.
52ee8690-43df-4325-b9df-3b02a8deed87
Smit, Johan J.
2a25b796-b15f-485c-b10d-08a813481c42
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Kochetov, Roman
9132fe00-0536-4082-a4ce-54253b2e9fe0
Gebrekiros, Yonas T.
626fd6b9-e1a6-4a4f-9ded-7b61e81d6473
Morshuis, Peter H.F.
52ee8690-43df-4325-b9df-3b02a8deed87
Smit, Johan J.
2a25b796-b15f-485c-b10d-08a813481c42

Andritsch, Thomas, Kochetov, Roman, Gebrekiros, Yonas T., Morshuis, Peter H.F. and Smit, Johan J. (2010) Short term DC breakdown strength in epoxy based BN nano- and microcomposites. 2010 10th IEEE International Conference on Solid Dielectrics (ICSD), Germany. 04 - 09 Jul 2010. pp. 1-4 . (doi:10.1109/ICSD.2010.5568098).

Record type: Conference or Workshop Item (Paper)

Abstract

Nanocomposites have been known in the field of electrical engineering for more than a decade, albeit there are still uncertainties of how the filler properties influence the properties of the composite material. Filler size, shape, aspect ratio and the surface modification, which consequently leads to even dispersion or clusters of particles, are all suspected to influence the dielectric behaviour of the insulation. But it is disputed what influences the properties to what extent. The focus of this paper is the dependence of the short term breakdown (BD) strength of polymer based composites filled with boron nitride (BN) on the filler size. Base polymer is commercially available bisphenol A epoxy with anhydrite hardener. As filler material we use boron nitride powder with different average particle sizes. These are ranging from 70 to 5000 nm. The particles were not surface modified in order to see solely the influence of the filler size on the BD strength. The short term BD strength was measured for negative DC voltages with Rogowski shaped electrodes. Dielectric spectroscopy was done complementarily to see how the filler size influences the relative permittivity of the composites.

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Published date: July 2010
Venue - Dates: 2010 10th IEEE International Conference on Solid Dielectrics (ICSD), Germany, 2010-07-04 - 2010-07-09
Organisations: EEE

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Local EPrints ID: 354465
URI: https://eprints.soton.ac.uk/id/eprint/354465
ISBN: 978-1-4244-7943-6
PURE UUID: 9e5fb16a-b80b-43a2-8de3-ff0a60d90d7f
ORCID for Thomas Andritsch: ORCID iD orcid.org/0000-0002-3462-022X

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Date deposited: 30 Jul 2013 11:33
Last modified: 20 Jul 2019 00:38

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Author: Thomas Andritsch ORCID iD
Author: Roman Kochetov
Author: Yonas T. Gebrekiros
Author: Peter H.F. Morshuis
Author: Johan J. Smit

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