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Impact of postcuring and water absorption on the dielectric response of epoxy-based composites filled with MgO nanoparticles

Impact of postcuring and water absorption on the dielectric response of epoxy-based composites filled with MgO nanoparticles
Impact of postcuring and water absorption on the dielectric response of epoxy-based composites filled with MgO nanoparticles
Present work addresses the dielectric spectroscopy investigation of epoxy-based composites, filled with magnesium oxide (MgO) nanoparticles with a fillgrade of up to 10 percent by weight. An even distribution of the nanoparticles was realized via ultrasonic vibration and high shear mixing. Dielectric spectroscopy measurement was performed on samples which were cured for 4 hours. Further measurement was performed after postcuring for 48 hours. The investigation of the complex permittivity was done in the frequency domain for temperatures ranging from -20°C to 120°C. A reduction of the relative permittivity for epoxy resin-MgO composite systems was observed, with fillgrades of 0.5, 2, 5 and 10 wt.%, compared to the reference neat epoxy. The explanation for that can be found in the nature and behavior of the interface polymer layer. This modified polymer layer was created on the surface of nanoparticles by means of applying a silane coupling agent and has different properties than the bulk polymer. The interface layer acts as a third phase beside the epoxy bulk and inorganic nanofiller. The results show a reduction of the real and imaginary parts of the complex permittivity, after subjecting the samples to heat treatment for 2 days. The postcuring process leads to further polymerization of the system and also to evaporation of water, which was absorbed by the nanofiller.
978-1-4577-0985-2
342-345
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5

Kochetov, R., Andritsch, T., Morshuis, P.H.F. and Smit, J.J. (2011) Impact of postcuring and water absorption on the dielectric response of epoxy-based composites filled with MgO nanoparticles. 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), , Cancun, Mexico. 16 - 19 Oct 2011. pp. 342-345 . (doi:10.1109/CEIDP.2011.6232666).

Record type: Conference or Workshop Item (Paper)

Abstract

Present work addresses the dielectric spectroscopy investigation of epoxy-based composites, filled with magnesium oxide (MgO) nanoparticles with a fillgrade of up to 10 percent by weight. An even distribution of the nanoparticles was realized via ultrasonic vibration and high shear mixing. Dielectric spectroscopy measurement was performed on samples which were cured for 4 hours. Further measurement was performed after postcuring for 48 hours. The investigation of the complex permittivity was done in the frequency domain for temperatures ranging from -20°C to 120°C. A reduction of the relative permittivity for epoxy resin-MgO composite systems was observed, with fillgrades of 0.5, 2, 5 and 10 wt.%, compared to the reference neat epoxy. The explanation for that can be found in the nature and behavior of the interface polymer layer. This modified polymer layer was created on the surface of nanoparticles by means of applying a silane coupling agent and has different properties than the bulk polymer. The interface layer acts as a third phase beside the epoxy bulk and inorganic nanofiller. The results show a reduction of the real and imaginary parts of the complex permittivity, after subjecting the samples to heat treatment for 2 days. The postcuring process leads to further polymerization of the system and also to evaporation of water, which was absorbed by the nanofiller.

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Published date: October 2011
Venue - Dates: 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), , Cancun, Mexico, 2011-10-16 - 2011-10-19
Organisations: EEE

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Local EPrints ID: 354470
URI: http://eprints.soton.ac.uk/id/eprint/354470
ISBN: 978-1-4577-0985-2
PURE UUID: b93ce5de-009c-482c-8817-c30acccd1f50
ORCID for T. Andritsch: ORCID iD orcid.org/0000-0002-3462-022X

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Date deposited: 30 Jul 2013 11:52
Last modified: 15 Mar 2024 03:48

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Contributors

Author: R. Kochetov
Author: T. Andritsch ORCID iD
Author: P.H.F. Morshuis
Author: J.J. Smit

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