Three-phase Lewis-Nielsen model for the thermal conductivity of polymer nanocomposites
Three-phase Lewis-Nielsen model for the thermal conductivity of polymer nanocomposites
The thermal conductivity of polymer-based microcomposites has been investigated for a long time. The existing theories predict the thermal conductivity of the polymers filled with conventional sized microparticles quite well. Significant effort has been made in studying and developing of the thermal conductivity behavior of a relatively new class of composites, which contain nanosized filler. A considerable volume of the polymer matrix has a modified structure with respect to the bulk polymer due to polymer-filler bonding via a silane coupling agent (SCA), which has been applied used to improve the thermal contact between the individual components. The thermal conductivity of a nanocomposite depends on the interfacial layer, which can be defined as a transition layer between a host material and incorporated nanofiller, rather then the thermal conductivities of the constituents. A composite material can be represented by composite particles embedded into the polymer matrix. A composite particle consists of a nanoparticle and the polymer close to the particle surface, which is organized by the surface modification. We propose a model for the thermal conductivity of the polymer nanocomposites. This model is intended to be used for systems which consist of a polymer matrix, nanofiller and the interfacial layer around the nanoparticles which has different properties than the bulk polymer.
978-1-4577-0985-2
338-341
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Korobko, A.V.
f0148c63-6884-426d-be63-e8ee84c83c10
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Picken, S.J.
d65451ac-e22e-4c42-88ec-bde69a6721b7
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
October 2011
Kochetov, R.
5647ae09-395a-4845-a4a9-51837a5c9aa0
Korobko, A.V.
f0148c63-6884-426d-be63-e8ee84c83c10
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Morshuis, P.H.F.
59248480-efdb-444e-b3f5-b39a3355315a
Picken, S.J.
d65451ac-e22e-4c42-88ec-bde69a6721b7
Smit, J.J.
21d902fe-6d70-4dff-ad29-3eb8146c0ea5
Kochetov, R., Korobko, A.V., Andritsch, T., Morshuis, P.H.F., Picken, S.J. and Smit, J.J.
(2011)
Three-phase Lewis-Nielsen model for the thermal conductivity of polymer nanocomposites.
2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), , Cancun, Mexico.
16 - 19 Oct 2011.
.
(doi:10.1109/CEIDP.2011.6232665).
Record type:
Conference or Workshop Item
(Paper)
Abstract
The thermal conductivity of polymer-based microcomposites has been investigated for a long time. The existing theories predict the thermal conductivity of the polymers filled with conventional sized microparticles quite well. Significant effort has been made in studying and developing of the thermal conductivity behavior of a relatively new class of composites, which contain nanosized filler. A considerable volume of the polymer matrix has a modified structure with respect to the bulk polymer due to polymer-filler bonding via a silane coupling agent (SCA), which has been applied used to improve the thermal contact between the individual components. The thermal conductivity of a nanocomposite depends on the interfacial layer, which can be defined as a transition layer between a host material and incorporated nanofiller, rather then the thermal conductivities of the constituents. A composite material can be represented by composite particles embedded into the polymer matrix. A composite particle consists of a nanoparticle and the polymer close to the particle surface, which is organized by the surface modification. We propose a model for the thermal conductivity of the polymer nanocomposites. This model is intended to be used for systems which consist of a polymer matrix, nanofiller and the interfacial layer around the nanoparticles which has different properties than the bulk polymer.
Text
ceidp11_nielsen.pdf
- Accepted Manuscript
Restricted to Registered users only
Request a copy
More information
Published date: October 2011
Venue - Dates:
2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), , Cancun, Mexico, 2011-10-16 - 2011-10-19
Organisations:
EEE
Identifiers
Local EPrints ID: 354474
URI: http://eprints.soton.ac.uk/id/eprint/354474
ISBN: 978-1-4577-0985-2
PURE UUID: 1c1e82fc-a955-4e02-89cb-db2eaa91dcf3
Catalogue record
Date deposited: 30 Jul 2013 13:28
Last modified: 15 Mar 2024 03:48
Export record
Altmetrics
Contributors
Author:
R. Kochetov
Author:
A.V. Korobko
Author:
T. Andritsch
Author:
P.H.F. Morshuis
Author:
S.J. Picken
Author:
J.J. Smit
Download statistics
Downloads from ePrints over the past year. Other digital versions may also be available to download e.g. from the publisher's website.
View more statistics