Design and fabrication of travelling wave dielectrophoresis structures
Design and fabrication of travelling wave dielectrophoresis structures
The design and fabrication of a generic travelling wave dielectrophoretic separation system is presented. A range of technical issues have been addressed and resolved. These include the optimization of the electrical insulation and electrical contact between different electrode layers and the choice of materials. A new method for fabricating microfluidic liquid channels, the fluidic channel cover and the seal within the channel, as well as an effective sample introduction system has been developed. A complete particle handling and fractionation system has been fabricated and the functioning of the device demonstrated with latex particles.
72-79
Cui, L.
957e39e8-e383-4178-a4f4-1d4ecda28ba6
Morgan, H.
de00d59f-a5a2-48c4-a99a-1d5dd7854174
1 March 2000
Cui, L.
957e39e8-e383-4178-a4f4-1d4ecda28ba6
Morgan, H.
de00d59f-a5a2-48c4-a99a-1d5dd7854174
Cui, L. and Morgan, H.
(2000)
Design and fabrication of travelling wave dielectrophoresis structures.
Journal of Micromechanics and Microengineering, 10 (1), .
(doi:10.1088/0960-1317/10/1/310).
Abstract
The design and fabrication of a generic travelling wave dielectrophoretic separation system is presented. A range of technical issues have been addressed and resolved. These include the optimization of the electrical insulation and electrical contact between different electrode layers and the choice of materials. A new method for fabricating microfluidic liquid channels, the fluidic channel cover and the seal within the channel, as well as an effective sample introduction system has been developed. A complete particle handling and fractionation system has been fabricated and the functioning of the device demonstrated with latex particles.
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Published date: 1 March 2000
Organisations:
Electronics & Computer Science
Identifiers
Local EPrints ID: 356168
URI: http://eprints.soton.ac.uk/id/eprint/356168
ISSN: 0960-1317
PURE UUID: 81d802da-7916-4564-9079-1184faba7f77
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Date deposited: 22 Nov 2013 14:00
Last modified: 15 Mar 2024 03:18
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Author:
L. Cui
Author:
H. Morgan
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