Low optical-loss facet preparation for silica-on-silicon photonics using the ductile dicing regime

Carpenter, Lewis, Rogers, Helen, Cooper, Peter A., Holmes, Christopher, Gates, James C. and Smith, Peter G.R. (2013) Low optical-loss facet preparation for silica-on-silicon photonics using the ductile dicing regime. Journal of Physics D: Applied Physics, 46 (47), 475103-[9pp]. (doi:10.1088/0022-3727/46/47/475103).

Abstract

The efficient production of high-quality facets for low-loss coupling is a significant production issue in integrated optics, usually requiring time consuming and manually intensive lapping and polishing steps, which add considerably to device fabrication costs. The development of precision dicing saws with diamond impregnated blades has allowed optical grade surfaces to be machined in crystalline materials such as lithium niobate and garnets. In this report we investigate the optimization of dicing machine parameters to obtain optical quality surfaces in a silica-on-silicon planar device demonstrating high optical quality in a commercially important glassy material. We achieve a surface roughness of 4.9 nm (Sa) using the optimized dicing conditions. By machining a groove across a waveguide, using the optimized dicing parameters, a grating based loss measurement technique is used to measure precisely the average free space interface loss per facet caused by scattering as a consequence of surface roughness. The average interface loss per facet was calculated to be: -0.63 dB and -0.76 dB for the TE and TM polarizations, respectively.

This record has no associated files available for download.

Contributors

Author: Christopher Holmes

Author: James C. Gates

Author: Peter G.R. Smith

Download statistics