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Polish-like facet preparation via dicing for silica integrated optics

Polish-like facet preparation via dicing for silica integrated optics
Polish-like facet preparation via dicing for silica integrated optics
Preparation of high quality facets for low-loss coupling is a significant production issue for integrated photonics, usually requiring time consuming lapping and polishing. Recently, the development of precision dicing saws with diamond impregnated blades has allowed the achievement of optical grade surfaces in optical materials based on dicing alone. In this report we investigate the optimization dicing conditions to achieve optical quality surfaces in a silica-on-silicon planar substrate and show what can be achieved by correct selection of machining parameters.
Carpenter, Lewis
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Rogers, Helen
c6b6aa89-b14c-48b6-92c0-dd5c5bca683c
Holmes, C.
16306bb8-8a46-4fd7-bb19-a146758e5263
Gates, J.C.
b71e31a1-8caa-477e-8556-b64f6cae0dc2
Smith, P.G.R.
8979668a-8b7a-4838-9a74-1a7cfc6665f6
Carpenter, Lewis
0daa548e-0d42-4b06-b914-45bfbec41759
Rogers, Helen
c6b6aa89-b14c-48b6-92c0-dd5c5bca683c
Holmes, C.
16306bb8-8a46-4fd7-bb19-a146758e5263
Gates, J.C.
b71e31a1-8caa-477e-8556-b64f6cae0dc2
Smith, P.G.R.
8979668a-8b7a-4838-9a74-1a7cfc6665f6

Carpenter, Lewis, Rogers, Helen, Holmes, C., Gates, J.C. and Smith, P.G.R. (2013) Polish-like facet preparation via dicing for silica integrated optics. SPIE Photonics West: Optical Components and Materials X, San Francisco, United States. 05 - 06 Feb 2013. (doi:10.1117/12.2004342).

Record type: Conference or Workshop Item (Paper)

Abstract

Preparation of high quality facets for low-loss coupling is a significant production issue for integrated photonics, usually requiring time consuming lapping and polishing. Recently, the development of precision dicing saws with diamond impregnated blades has allowed the achievement of optical grade surfaces in optical materials based on dicing alone. In this report we investigate the optimization dicing conditions to achieve optical quality surfaces in a silica-on-silicon planar substrate and show what can be achieved by correct selection of machining parameters.

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More information

Published date: February 2013
Venue - Dates: SPIE Photonics West: Optical Components and Materials X, San Francisco, United States, 2013-02-05 - 2013-02-06
Organisations: Optoelectronics Research Centre

Identifiers

Local EPrints ID: 360178
URI: http://eprints.soton.ac.uk/id/eprint/360178
PURE UUID: 5f1fe910-29a2-4b48-b5e8-97ea8f827095
ORCID for C. Holmes: ORCID iD orcid.org/0000-0001-9021-3760
ORCID for J.C. Gates: ORCID iD orcid.org/0000-0001-8671-5987
ORCID for P.G.R. Smith: ORCID iD orcid.org/0000-0003-0319-718X

Catalogue record

Date deposited: 28 Nov 2013 14:03
Last modified: 15 Mar 2024 03:27

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Contributors

Author: Lewis Carpenter
Author: Helen Rogers
Author: C. Holmes ORCID iD
Author: J.C. Gates ORCID iD
Author: P.G.R. Smith ORCID iD

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