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A novel fabrication process to realize a valveless micropump on a flexible substrate

A novel fabrication process to realize a valveless micropump on a flexible substrate
A novel fabrication process to realize a valveless micropump on a flexible substrate
This paper reports, for the first time, on the design, fabrication and testing of a planar valveless micropump, entirely screen printed onto a flexible polyimide (Kapton) substrate using sacrificial, structural, conductive and piezoelectric layers. The sacrificial layer, used to achieve a pump chamber and inlet/outlet channels, is removed using water followed by a 140?° C heat treatment to evaporate the water from the structure. The fabrication process is analogous to a standard silicon based micro-electro-mechanical system sacrificial process. Applying a sinusoidal AC voltage to the piezoelectric layer drives a flexible membrane which pumps a liquid through the chamber. A maximum flow rate of 38 ?l min?1 was achieved using a drive frequency of 3 kHz.
25034
Wei, Yang
c6d13914-4f35-459c-8c25-8f8b77b7c5b3
Torah, Russel
7147b47b-db01-4124-95dc-90d6a9842688
Yang, Kai
f1c9b81d-e821-47eb-a69e-b3bc419de9c7
Beeby, Steve
ba565001-2812-4300-89f1-fe5a437ecb0d
Tudor, John
46eea408-2246-4aa0-8b44-86169ed601ff
Wei, Yang, Torah, Russel, Yang, Kai, Beeby, Steve and Tudor, John (2014) A novel fabrication process to realize a valveless micropump on a flexible substrate Smart Materials and Structures, 23, (2), p. 25034. (doi:10.1088/0964-1726/23/2/025034).

Wei, Yang, Torah, Russel, Yang, Kai, Beeby, Steve and Tudor, John (2014) A novel fabrication process to realize a valveless micropump on a flexible substrate Smart Materials and Structures, 23, (2), p. 25034. (doi:10.1088/0964-1726/23/2/025034).

Record type: Article

Abstract

This paper reports, for the first time, on the design, fabrication and testing of a planar valveless micropump, entirely screen printed onto a flexible polyimide (Kapton) substrate using sacrificial, structural, conductive and piezoelectric layers. The sacrificial layer, used to achieve a pump chamber and inlet/outlet channels, is removed using water followed by a 140?° C heat treatment to evaporate the water from the structure. The fabrication process is analogous to a standard silicon based micro-electro-mechanical system sacrificial process. Applying a sinusoidal AC voltage to the piezoelectric layer drives a flexible membrane which pumps a liquid through the chamber. A maximum flow rate of 38 ?l min?1 was achieved using a drive frequency of 3 kHz.

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More information

Accepted/In Press date: 17 December 2013
e-pub ahead of print date: 9 January 2014
Published date: 9 January 2014
Organisations: EEE

Identifiers

Local EPrints ID: 361086
URI: http://eprints.soton.ac.uk/id/eprint/361086
PURE UUID: a58cc2aa-9188-40cd-b558-664ed1447ffe
ORCID for Yang Wei: ORCID iD orcid.org/0000-0001-6195-8595
ORCID for Steve Beeby: ORCID iD orcid.org/0000-0002-0800-1759

Catalogue record

Date deposited: 13 Jan 2014 13:21
Last modified: 15 Sep 2017 16:33

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Contributors

Author: Yang Wei ORCID iD
Author: Russel Torah
Author: Kai Yang
Author: Steve Beeby ORCID iD
Author: John Tudor

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