A novel fabrication process to realize a valveless micropump on a flexible substrate


Wei, Yang, Torah, Russel, Yang, Kai, Beeby, Steve and Tudor, John (2014) A novel fabrication process to realize a valveless micropump on a flexible substrate Smart Materials and Structures, 23, (2), p. 25034. (doi:10.1088/0964-1726/23/2/025034).

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Description/Abstract

This paper reports, for the first time, on the design, fabrication and testing of a planar valveless micropump, entirely screen printed onto a flexible polyimide (Kapton) substrate using sacrificial, structural, conductive and piezoelectric layers. The sacrificial layer, used to achieve a pump chamber and inlet/outlet channels, is removed using water followed by a 140?° C heat treatment to evaporate the water from the structure. The fabrication process is analogous to a standard silicon based micro-electro-mechanical system sacrificial process. Applying a sinusoidal AC voltage to the piezoelectric layer drives a flexible membrane which pumps a liquid through the chamber. A maximum flow rate of 38 ?l min?1 was achieved using a drive frequency of 3 kHz.

Item Type: Article
Digital Object Identifier (DOI): doi:10.1088/0964-1726/23/2/025034
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
T Technology > TS Manufactures
Organisations: EEE
ePrint ID: 361086
Date :
Date Event
9 January 2014Published
Date Deposited: 13 Jan 2014 13:21
Last Modified: 23 Feb 2017 01:44
Further Information:Google Scholar
URI: http://eprints.soton.ac.uk/id/eprint/361086

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