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Editorial. Nanostructured materials for microelectronic applications

Editorial. Nanostructured materials for microelectronic applications
Editorial. Nanostructured materials for microelectronic applications
The Scope of the Special Issue. Nanostructured materials are a new class of materials, having dimensions in the 1~100?nm range, which provide one of the greatest potentials for improving performance and extended capabilities of products in a number of industrial sectors. Nanostructures can be divided into zero-dimensional (0D when they are quantum dot or nanoparticle structures), one-dimensional (1D when they are elongated), and two-dimensional (2D when they are planar) based on their shapes. The recent emphasis in the nanomaterials research has been on 1D nanostructures perhaps due to the intriguing possibility of using them in the majority of short-term future applications. The most successful examples are seen in the microelectronics, where “smaller” has always meant a greater performance ever since the invention of transistors, for example, higher density of integration, faster response, lower cost, and less power consumption. In recent years, applications of nanostructured nanomaterials on microelectronic devices have been a highly developing field, due to the flexibility and the light weight for daily use, which has the potential to be deployable. Therefore the fields of nanostructure devices have been the subject of reviews.
With the continuous downscaling of material technologies, reliability is more and more becoming a major bottleneck. First of all the electric fields and mechanical stress have increased continuously and are now reaching the maximum values that can be allowed for reliable operation. At this time, we are introducing nanomaterials and a new design to maintain the effective performance scaling. Some materials like the low carbon alloy steel, transparency conducting AZO films, piezoelectric material, AlN flake, and titanium dioxide films have already been introduced and under investigation. These materials and devices often have unknown reliability behavior and/or introduce new failure mechanisms. In addition, the market is continuously demanding higher reliability levels for present technologies. The chance to share and discuss these crucial nanostructured materials for microelectronic developments is very important.
This special issue selects 9 papers about materials for microelectronic applications and other related fields. This special issue enables interdisciplinary collaboration between material science and engineering technologists in the academic and industrial fields.
1687-8442
p.1
Chang, Shoou-Jinn
2ddcfe84-e154-48fb-a7f9-b36fc7535868
Meen, Teen-Hang
3442d34b-ce94-47b4-9c70-d0c40e085c60
Prior, Stephen D.
9c753e49-092a-4dc5-b4cd-6d5ff77e9ced
Lam, Kin-Tak
59e5596e-bc76-4f60-a93c-ac9b59496065
Ji, Liang-Wen
3f4d5ba2-a4a1-436a-a8e0-c7d4c167a5f7
Chang, Shoou-Jinn
2ddcfe84-e154-48fb-a7f9-b36fc7535868
Meen, Teen-Hang
3442d34b-ce94-47b4-9c70-d0c40e085c60
Prior, Stephen D.
9c753e49-092a-4dc5-b4cd-6d5ff77e9ced
Lam, Kin-Tak
59e5596e-bc76-4f60-a93c-ac9b59496065
Ji, Liang-Wen
3f4d5ba2-a4a1-436a-a8e0-c7d4c167a5f7

Chang, Shoou-Jinn, Meen, Teen-Hang, Prior, Stephen D., Lam, Kin-Tak and Ji, Liang-Wen (2014) Editorial. Nanostructured materials for microelectronic applications. Advances in Materials Science and Engineering, 2014 (383041), p.1. (doi:10.1155/2014/383041).

Record type: Article

Abstract

The Scope of the Special Issue. Nanostructured materials are a new class of materials, having dimensions in the 1~100?nm range, which provide one of the greatest potentials for improving performance and extended capabilities of products in a number of industrial sectors. Nanostructures can be divided into zero-dimensional (0D when they are quantum dot or nanoparticle structures), one-dimensional (1D when they are elongated), and two-dimensional (2D when they are planar) based on their shapes. The recent emphasis in the nanomaterials research has been on 1D nanostructures perhaps due to the intriguing possibility of using them in the majority of short-term future applications. The most successful examples are seen in the microelectronics, where “smaller” has always meant a greater performance ever since the invention of transistors, for example, higher density of integration, faster response, lower cost, and less power consumption. In recent years, applications of nanostructured nanomaterials on microelectronic devices have been a highly developing field, due to the flexibility and the light weight for daily use, which has the potential to be deployable. Therefore the fields of nanostructure devices have been the subject of reviews.
With the continuous downscaling of material technologies, reliability is more and more becoming a major bottleneck. First of all the electric fields and mechanical stress have increased continuously and are now reaching the maximum values that can be allowed for reliable operation. At this time, we are introducing nanomaterials and a new design to maintain the effective performance scaling. Some materials like the low carbon alloy steel, transparency conducting AZO films, piezoelectric material, AlN flake, and titanium dioxide films have already been introduced and under investigation. These materials and devices often have unknown reliability behavior and/or introduce new failure mechanisms. In addition, the market is continuously demanding higher reliability levels for present technologies. The chance to share and discuss these crucial nanostructured materials for microelectronic developments is very important.
This special issue selects 9 papers about materials for microelectronic applications and other related fields. This special issue enables interdisciplinary collaboration between material science and engineering technologists in the academic and industrial fields.

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More information

Published date: 6 March 2014
Organisations: Computational Engineering & Design Group

Identifiers

Local EPrints ID: 362863
URI: http://eprints.soton.ac.uk/id/eprint/362863
ISSN: 1687-8442
PURE UUID: 1fc03b96-b92d-45ce-be3a-438a703fe48f
ORCID for Stephen D. Prior: ORCID iD orcid.org/0000-0002-4993-4942

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Date deposited: 12 Mar 2014 17:40
Last modified: 18 Feb 2021 17:20

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Contributors

Author: Shoou-Jinn Chang
Author: Teen-Hang Meen
Author: Kin-Tak Lam
Author: Liang-Wen Ji

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