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Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications

Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications
Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications
We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists.
functionalization of polymers, microstructure, photoresists, selectivity
0021-8995
2189-2195
Kontziampasis, D.
0bffea5c-c766-4f82-b153-e5c00ac3df33
Beltsios, K.
3f4b34f6-0a28-4c64-8cba-0aec8422a95d
Tegou, E.
5b0fe3a5-3e99-4232-b50c-c415bfb1d01d
Argitis, P.
8c951b9a-be53-442a-bd6e-363194be1c70
Gogolides, E.
3d1c5569-8ab3-4708-b7ff-df91d299658e
Kontziampasis, D.
0bffea5c-c766-4f82-b153-e5c00ac3df33
Beltsios, K.
3f4b34f6-0a28-4c64-8cba-0aec8422a95d
Tegou, E.
5b0fe3a5-3e99-4232-b50c-c415bfb1d01d
Argitis, P.
8c951b9a-be53-442a-bd6e-363194be1c70
Gogolides, E.
3d1c5569-8ab3-4708-b7ff-df91d299658e

Kontziampasis, D., Beltsios, K., Tegou, E., Argitis, P. and Gogolides, E. (2010) Optimized surface silylation of chemically amplified epoxidized photoresists for micromachining applications Journal of Applied Polymer Science, 117, (4), pp. 2189-2195. (doi:10.1002/app.31644).

Record type: Article

Abstract

We explored the selective wet silylation of noncrosslinked areas of epoxidized photoresists using chlorosilanes. Emphasis was placed on the Si uptake of the epoxy films when controlled low levels of water were incorporated into the silylation solution. Fourier transform infrared measurements and oxygen-plasma resistance data with in situ laser interferometry and multiwavelength ellipsometry are presented. The fine tuning of the moisture level was found to be crucial for the generation of satisfactory and reproducible structures. The optimized version of the process was shown to be useful for epoxy-based dry micromachining. Overall, an attractive positive-tone process is presented as an alternative to the usual negative-tone process for commercial epoxy resists.

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More information

e-pub ahead of print date: 13 April 2010
Published date: 15 August 2010
Keywords: functionalization of polymers, microstructure, photoresists, selectivity
Organisations: Nanoelectronics and Nanotechnology

Identifiers

Local EPrints ID: 368027
URI: http://eprints.soton.ac.uk/id/eprint/368027
ISSN: 0021-8995
PURE UUID: de79aae8-f6a6-43a4-bd5e-2a54863514c1

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Date deposited: 10 Sep 2014 13:43
Last modified: 18 Jul 2017 01:52

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Contributors

Author: D. Kontziampasis
Author: K. Beltsios
Author: E. Tegou
Author: P. Argitis
Author: E. Gogolides

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