Effects of Cu and of annealing temperature on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
Effects of Cu and of annealing temperature on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
Effects of Cu and of annealing temperature on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2
20 May 2013
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2
Callisti, M., Mellor, B.G. and Polcar, T.
(2013)
Effects of Cu and of annealing temperature on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films.
Shape Memory and Superelastic Technologies (SMST 2013), Prague, Czech Republic.
19 - 23 May 2013.
Record type:
Conference or Workshop Item
(Poster)
Abstract
Effects of Cu and of annealing temperature on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
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Published date: 20 May 2013
Venue - Dates:
Shape Memory and Superelastic Technologies (SMST 2013), Prague, Czech Republic, 2013-05-19 - 2013-05-23
Organisations:
nCATS Group
Identifiers
Local EPrints ID: 373330
URI: http://eprints.soton.ac.uk/id/eprint/373330
PURE UUID: d58a59c1-cce8-4bac-80f5-2e2763975fd2
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Date deposited: 15 Jan 2015 13:29
Last modified: 12 Dec 2021 03:51
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Contributors
Author:
M. Callisti
Author:
B.G. Mellor
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