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Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Tichelaar, F.D.
83605204-7d2d-4497-88cf-8743909e7a05
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Tichelaar, F.D.
83605204-7d2d-4497-88cf-8743909e7a05
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2

Callisti, M., Tichelaar, F.D., Mellor, B.G. and Polcar, T. (2013) Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films. European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2013), Sevilla, Spain. 07 - 12 Sep 2013.

Record type: Conference or Workshop Item (Other)

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More information

Published date: 8 September 2013
Venue - Dates: European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2013), Sevilla, Spain, 2013-09-07 - 2013-09-12
Organisations: nCATS Group

Identifiers

Local EPrints ID: 373438
URI: http://eprints.soton.ac.uk/id/eprint/373438
PURE UUID: 69f862bc-1193-4f6b-97dc-d94a939c2023
ORCID for T. Polcar: ORCID iD orcid.org/0000-0002-0863-6287

Catalogue record

Date deposited: 19 Jan 2015 11:55
Last modified: 09 Jan 2022 03:37

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Contributors

Author: M. Callisti
Author: F.D. Tichelaar
Author: B.G. Mellor
Author: T. Polcar ORCID iD

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