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Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Tichelaar, F. D.
b96cf2d4-b18c-48a5-87e2-236b9f48aa60
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Tichelaar, F. D.
b96cf2d4-b18c-48a5-87e2-236b9f48aa60
Mellor, B.G.
2b13b80f-880b-49ac-82fe-827a15dde2fe
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2

Callisti, M., Tichelaar, F. D., Mellor, B.G. and Polcar, T. (2013) Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films. ICMCTF: 40th International Conference on Metallurgical Coatings and Thin Films, United States. 29 Apr - 03 May 2013.

Record type: Conference or Workshop Item (Other)

Full text not available from this repository.

More information

e-pub ahead of print date: 29 May 2013
Venue - Dates: ICMCTF: 40th International Conference on Metallurgical Coatings and Thin Films, United States, 2013-04-29 - 2013-05-03
Organisations: nCATS Group

Identifiers

Local EPrints ID: 373641
URI: https://eprints.soton.ac.uk/id/eprint/373641
PURE UUID: 379c55ff-b037-4542-aa47-07c18337bc54
ORCID for T. Polcar: ORCID iD orcid.org/0000-0002-0863-6287

Catalogue record

Date deposited: 27 Jan 2015 14:36
Last modified: 20 Jul 2019 00:43

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