Microstructural evolution of nanometric Ti(NiCu)2 precipitates in annealed Ni–Ti–Cu thin films
Microstructural evolution of nanometric Ti(NiCu)2 precipitates in annealed Ni–Ti–Cu thin films
1-3
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2
July 2015
Callisti, M.
093b5320-2398-4d72-8b09-278d22a08937
Polcar, T.
c669b663-3ba9-4e7b-9f97-8ef5655ac6d2
Callisti, M. and Polcar, T.
(2015)
Microstructural evolution of nanometric Ti(NiCu)2 precipitates in annealed Ni–Ti–Cu thin films.
Vacuum, 117, .
(doi:10.1016/j.vacuum.2015.03.028).
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Accepted/In Press date: 23 March 2015
e-pub ahead of print date: 2 April 2015
Published date: July 2015
Organisations:
Engineering Mats & Surface Engineerg Gp
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Local EPrints ID: 376055
URI: http://eprints.soton.ac.uk/id/eprint/376055
ISSN: 0042-207X
PURE UUID: 6e03ce97-4dd6-42d7-b648-5b3b529b4020
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Date deposited: 24 Apr 2015 13:49
Last modified: 15 Mar 2024 03:40
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Author:
M. Callisti
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