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The Effect of Resin Stoichiometry and Nanoparticle Addition on Epoxy/Silica Nanodielectrics

The Effect of Resin Stoichiometry and Nanoparticle Addition on Epoxy/Silica Nanodielectrics
The Effect of Resin Stoichiometry and Nanoparticle Addition on Epoxy/Silica Nanodielectrics
Epoxy-based systems are used widely as dielectrics in electrical applications and, in such systems, the chosen stoichiometry is important in determining the nature of the molecular network that forms and, hence, the physical properties of the final system. However, the inclusion of nanoparticles with large interfacial areas into epoxy systems may introduce additional chemical reactions between moieties on the nanoparticle surfaces and the reactants, or may alter the rate and sequence of the various chemical pathways that occur during curing, with the consequence that the cross-linked network that forms within the matrix polymer will be altered. This study set out to investigate the effects of resin stoichiometry on material properties, including the glass transition temperature and electrical breakdown strength of an epoxy resin and its nanocomposites filled with silica particles, which were introduced using a Nanopox masterbatch system. The results indicate that the nanosilica affects network formation in complex ways and that the concept of an optimum stoichiometry is highly dependent upon the property of interest. From the perspective of breakdown strength, a stoichiometric excess of anhydride hardener is detrimental; the introduction of nanoparticles has a comparable effect to an excess of hardener.
Epoxy resin, nanodielectrics, structure, dielectric properties.
1070-9878
895-905
Nguyen, V T
0fb0723b-a118-4ecb-82de-9460c18adf53
Vaughan, A S
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Lewin, P L
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Krivda, A
73f11276-1939-4036-893c-e32deb7eb80c
Nguyen, V T
0fb0723b-a118-4ecb-82de-9460c18adf53
Vaughan, A S
6d813b66-17f9-4864-9763-25a6d659d8a3
Lewin, P L
78b4fc49-1cb3-4db9-ba90-3ae70c0f639e
Krivda, A
73f11276-1939-4036-893c-e32deb7eb80c

Nguyen, V T, Vaughan, A S, Lewin, P L and Krivda, A (2015) The Effect of Resin Stoichiometry and Nanoparticle Addition on Epoxy/Silica Nanodielectrics. IEEE Transactions on Dielectrics & Electrical Insulation, 22 (2), 895-905.

Record type: Article

Abstract

Epoxy-based systems are used widely as dielectrics in electrical applications and, in such systems, the chosen stoichiometry is important in determining the nature of the molecular network that forms and, hence, the physical properties of the final system. However, the inclusion of nanoparticles with large interfacial areas into epoxy systems may introduce additional chemical reactions between moieties on the nanoparticle surfaces and the reactants, or may alter the rate and sequence of the various chemical pathways that occur during curing, with the consequence that the cross-linked network that forms within the matrix polymer will be altered. This study set out to investigate the effects of resin stoichiometry on material properties, including the glass transition temperature and electrical breakdown strength of an epoxy resin and its nanocomposites filled with silica particles, which were introduced using a Nanopox masterbatch system. The results indicate that the nanosilica affects network formation in complex ways and that the concept of an optimum stoichiometry is highly dependent upon the property of interest. From the perspective of breakdown strength, a stoichiometric excess of anhydride hardener is detrimental; the introduction of nanoparticles has a comparable effect to an excess of hardener.

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Accepted/In Press date: 3 September 2014
Published date: 1 April 2015
Keywords: Epoxy resin, nanodielectrics, structure, dielectric properties.
Organisations: EEE

Identifiers

Local EPrints ID: 376357
URI: http://eprints.soton.ac.uk/id/eprint/376357
ISSN: 1070-9878
PURE UUID: 31b11a52-51e8-4eef-a796-9b969b0b67b9
ORCID for A S Vaughan: ORCID iD orcid.org/0000-0002-0535-513X

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Date deposited: 17 Apr 2015 15:26
Last modified: 12 Nov 2019 01:52

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Contributors

Author: V T Nguyen
Author: A S Vaughan ORCID iD
Author: P L Lewin
Author: A Krivda

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