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Microstructure and microhardness of OFHC copper processed by high-pressure torsion

Microstructure and microhardness of OFHC copper processed by high-pressure torsion
Microstructure and microhardness of OFHC copper processed by high-pressure torsion
An ultra-high purity oxygen free high conductivity (OFHC) Cu was investigated to determine the evolution of microstructure and microhardness during processing by high-pressure torsion (HPT). Disks were processed at ambient temperature, the microstructures were observed at the center, mid-radius and near-edge positions and the Vickers microhardness was recorded along radial directions. At low strains, ?3 twin boundaries are formed due to dynamic recrystallization before microstructural refinement and ultimately a stabilized ultrafine grain structure is formed in the near-edge position with an average grain size of ~280 nm after 10 turns. Measurements show the microhardness initially increases to ~150 Hv at an equivalent strain of ~2, then falls to about ~80 Hv during dynamic recrystallization up to a strain of ~8 and thereafter increases again to a saturated value of ~150 Hv at strains above ~22. The delay in microstructure and microhardness homogeneity by dynamic recrystallization is attributed to the high purity of Cu that enhances dislocation mobility and causes dynamic softening during the early stages of straining.
HPT, microhardness, microstructure, OFHC copper, recrystallization
0921-5093
21-28
Almazrouee, Abdulla I.
6aaff277-2dcc-4dbd-afd0-75620aa6b6a9
Al-Fadhalah, Khaled J.
364d5aed-c107-4104-9be0-6bf0ae28d20b
Alhajeri, Saleh N.
4d3f50b6-87ab-4690-87dd-bea08fb1c77f
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Almazrouee, Abdulla I.
6aaff277-2dcc-4dbd-afd0-75620aa6b6a9
Al-Fadhalah, Khaled J.
364d5aed-c107-4104-9be0-6bf0ae28d20b
Alhajeri, Saleh N.
4d3f50b6-87ab-4690-87dd-bea08fb1c77f
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86

Almazrouee, Abdulla I., Al-Fadhalah, Khaled J., Alhajeri, Saleh N. and Langdon, Terence G. (2015) Microstructure and microhardness of OFHC copper processed by high-pressure torsion. Materials Science and Engineering: A, 641, 21-28. (doi:10.1016/j.msea.2015.06.016).

Record type: Article

Abstract

An ultra-high purity oxygen free high conductivity (OFHC) Cu was investigated to determine the evolution of microstructure and microhardness during processing by high-pressure torsion (HPT). Disks were processed at ambient temperature, the microstructures were observed at the center, mid-radius and near-edge positions and the Vickers microhardness was recorded along radial directions. At low strains, ?3 twin boundaries are formed due to dynamic recrystallization before microstructural refinement and ultimately a stabilized ultrafine grain structure is formed in the near-edge position with an average grain size of ~280 nm after 10 turns. Measurements show the microhardness initially increases to ~150 Hv at an equivalent strain of ~2, then falls to about ~80 Hv during dynamic recrystallization up to a strain of ~8 and thereafter increases again to a saturated value of ~150 Hv at strains above ~22. The delay in microstructure and microhardness homogeneity by dynamic recrystallization is attributed to the high purity of Cu that enhances dislocation mobility and causes dynamic softening during the early stages of straining.

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Almazrouee_Microstructure.pdf - Accepted Manuscript
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More information

Accepted/In Press date: 4 June 2015
e-pub ahead of print date: 9 June 2015
Published date: 12 August 2015
Keywords: HPT, microhardness, microstructure, OFHC copper, recrystallization
Organisations: Faculty of Engineering and the Environment

Identifiers

Local EPrints ID: 378060
URI: https://eprints.soton.ac.uk/id/eprint/378060
ISSN: 0921-5093
PURE UUID: 55b7d406-0210-491a-b968-7254c4ab1829
ORCID for Terence G. Langdon: ORCID iD orcid.org/0000-0003-3541-9250

Catalogue record

Date deposited: 24 Jun 2015 13:12
Last modified: 06 Jun 2018 12:48

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Contributors

Author: Abdulla I. Almazrouee
Author: Khaled J. Al-Fadhalah
Author: Saleh N. Alhajeri

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