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The effect of material processing on the dielectric properties of polystyrene boron nitride nanocomposites

The effect of material processing on the dielectric properties of polystyrene boron nitride nanocomposites
The effect of material processing on the dielectric properties of polystyrene boron nitride nanocomposites
Extensive experimental work in the area of polymer nanocomposites has been done over the past two decades to explore their potential. In this study, a range of related polymer nanocomposite materials was prepared using a solvent blending method, using dichloromethane (DCM), toluene (TOL) and chlorobenzene (CB) to dissolve the polymer, atactic polystyrene (a-PS), and disperse the filler, hexagonal boron nitride (hBN). Where TOL and CB were used, heat was used in material processing, whereas the material was processed at room temperature with DCM. The largest increase in breakdown strength is observed in the materials processed with TOL and CB. The hBN appears to be well dispersed in these systems and more agglomerated in the DCM system as shown from SEM.
978-1-4799-7354-5
333-336
Ayoob, R.
9520a234-f49a-45b9-ba23-c4d0e500da14
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, A.S.
6d813b66-17f9-4864-9763-25a6d659d8a3
Ayoob, R.
9520a234-f49a-45b9-ba23-c4d0e500da14
Andritsch, T.
8681e640-e584-424e-a1f1-0d8b713de01c
Vaughan, A.S.
6d813b66-17f9-4864-9763-25a6d659d8a3

Ayoob, R., Andritsch, T. and Vaughan, A.S. (2015) The effect of material processing on the dielectric properties of polystyrene boron nitride nanocomposites. 2015 IEEE Electrical Insulation Conference (EIC), United States. 07 - 10 Jun 2015. pp. 333-336 .

Record type: Conference or Workshop Item (Paper)

Abstract

Extensive experimental work in the area of polymer nanocomposites has been done over the past two decades to explore their potential. In this study, a range of related polymer nanocomposite materials was prepared using a solvent blending method, using dichloromethane (DCM), toluene (TOL) and chlorobenzene (CB) to dissolve the polymer, atactic polystyrene (a-PS), and disperse the filler, hexagonal boron nitride (hBN). Where TOL and CB were used, heat was used in material processing, whereas the material was processed at room temperature with DCM. The largest increase in breakdown strength is observed in the materials processed with TOL and CB. The hBN appears to be well dispersed in these systems and more agglomerated in the DCM system as shown from SEM.

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Published date: 7 June 2015
Venue - Dates: 2015 IEEE Electrical Insulation Conference (EIC), United States, 2015-06-07 - 2015-06-10
Organisations: EEE

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Local EPrints ID: 378087
URI: https://eprints.soton.ac.uk/id/eprint/378087
ISBN: 978-1-4799-7354-5
PURE UUID: 1af89b14-934e-4183-b1f6-a1d17e3ba6bf
ORCID for T. Andritsch: ORCID iD orcid.org/0000-0002-3462-022X
ORCID for A.S. Vaughan: ORCID iD orcid.org/0000-0002-0535-513X

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Date deposited: 16 Jun 2015 11:06
Last modified: 09 May 2019 00:36

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Contributors

Author: R. Ayoob
Author: T. Andritsch ORCID iD
Author: A.S. Vaughan ORCID iD

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