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Investigation of the morphology in AlN filled epoxy based composite materials

Investigation of the morphology in AlN filled epoxy based composite materials
Investigation of the morphology in AlN filled epoxy based composite materials
This paper investigates the structure of bisphenol-A epoxy based composites with low amounts of aluminium nitride (from 0.5 to 10 % by weight), which were originally chosen for their high thermal conductivity. Aim of this research was to investigate the applicability of interphase models on amorphous thermosets. The filler content was confirmed with thermogravimetric analysis, and previous measurements of the dielectric properties re-examined. The results of transmission electron microscopy and differential scanning calorimetry suggest that epoxy based insulation materials don't exhibit distinct interfacial restructuring on the nanoscale, but rather a widespread change of the micro structure, even for smallest amounts of additives.
978-1-4799-7352-1
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Zhang, Sixiang
1cc338d3-efcd-4917-83ac-b265add1aa19
Kochetov, Roman
9132fe00-0536-4082-a4ce-54253b2e9fe0
Andritsch, Thomas
8681e640-e584-424e-a1f1-0d8b713de01c
Zhang, Sixiang
1cc338d3-efcd-4917-83ac-b265add1aa19
Kochetov, Roman
9132fe00-0536-4082-a4ce-54253b2e9fe0

Andritsch, Thomas, Zhang, Sixiang and Kochetov, Roman (2015) Investigation of the morphology in AlN filled epoxy based composite materials. IEEE Electrical Insulation Conference (EIC) 2015, United States. 07 - 10 Jun 2015. (doi:10.1109/ICACACT.2014.7223518).

Record type: Conference or Workshop Item (Other)

Abstract

This paper investigates the structure of bisphenol-A epoxy based composites with low amounts of aluminium nitride (from 0.5 to 10 % by weight), which were originally chosen for their high thermal conductivity. Aim of this research was to investigate the applicability of interphase models on amorphous thermosets. The filler content was confirmed with thermogravimetric analysis, and previous measurements of the dielectric properties re-examined. The results of transmission electron microscopy and differential scanning calorimetry suggest that epoxy based insulation materials don't exhibit distinct interfacial restructuring on the nanoscale, but rather a widespread change of the micro structure, even for smallest amounts of additives.

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Published date: 7 June 2015
Venue - Dates: IEEE Electrical Insulation Conference (EIC) 2015, United States, 2015-06-07 - 2015-06-10
Organisations: EEE

Identifiers

Local EPrints ID: 381965
URI: https://eprints.soton.ac.uk/id/eprint/381965
ISBN: 978-1-4799-7352-1
PURE UUID: 667a9c56-8e84-4f18-b8b7-a03c80fd008f
ORCID for Thomas Andritsch: ORCID iD orcid.org/0000-0002-3462-022X

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Date deposited: 15 Oct 2015 10:36
Last modified: 20 Jul 2019 00:38

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