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Microstructural evolution and micro-compression in high-purity copper processed by high-pressure torsion

Microstructural evolution and micro-compression in high-purity copper processed by high-pressure torsion
Microstructural evolution and micro-compression in high-purity copper processed by high-pressure torsion
Pure copper is subjected to severe plastic deformation at room temperature using quasi-constrained high-pressure torsion through 1/4 to 10 turns. The evolution of the microstructure is monitored using X-ray diffraction and electron backscatter diffraction. Specimens are analyzed both before and after micro-compression of ?50%. The results show that after 10 turns there is a homogeneous ultrafine-grained (UFG) microstructure with an average grain size of ?250?nm and with a simple shear texture. The micro-compression testing shows that UFG specimens exhibit a better surface quality after compression thereby demonstrating an excellent potential for using UFG copper in micro-forming.
microstructural, evolution, micro-compression, high, purity, copper, processed, pressure, torsion
1438-1656
241-250
Li, Jianwei
299f1c63-8058-414b-afd1-c5c9a6a13762
Xu, Jie
593871b5-a17a-4e0f-ae0e-7e48b1aadd99
Wang, Chuan Ting
80ad9adf-a9df-49ed-934d-fa64505b920d
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
6454155d-fa5f-480b-8747-88d06498a923
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86
Li, Jianwei
299f1c63-8058-414b-afd1-c5c9a6a13762
Xu, Jie
593871b5-a17a-4e0f-ae0e-7e48b1aadd99
Wang, Chuan Ting
80ad9adf-a9df-49ed-934d-fa64505b920d
Shan, Debin
fd8652eb-1eeb-4ae2-bcc4-102320f3c2d7
Guo, Bin
6454155d-fa5f-480b-8747-88d06498a923
Langdon, Terence G.
86e69b4f-e16d-4830-bf8a-5a9c11f0de86

Li, Jianwei, Xu, Jie, Wang, Chuan Ting, Shan, Debin, Guo, Bin and Langdon, Terence G. (2016) Microstructural evolution and micro-compression in high-purity copper processed by high-pressure torsion. Advanced Engineering Materials, 18, 241-250. (doi:10.1002/adem.201500488).

Record type: Article

Abstract

Pure copper is subjected to severe plastic deformation at room temperature using quasi-constrained high-pressure torsion through 1/4 to 10 turns. The evolution of the microstructure is monitored using X-ray diffraction and electron backscatter diffraction. Specimens are analyzed both before and after micro-compression of ?50%. The results show that after 10 turns there is a homogeneous ultrafine-grained (UFG) microstructure with an average grain size of ?250?nm and with a simple shear texture. The micro-compression testing shows that UFG specimens exhibit a better surface quality after compression thereby demonstrating an excellent potential for using UFG copper in micro-forming.

Full text not available from this repository.

More information

Accepted/In Press date: 28 October 2015
e-pub ahead of print date: 17 November 2015
Published date: February 2016
Keywords: microstructural, evolution, micro-compression, high, purity, copper, processed, pressure, torsion
Organisations: Engineering Mats & Surface Engineerg Gp, Engineering Science Unit, Faculty of Engineering and the Environment

Identifiers

Local EPrints ID: 386315
URI: http://eprints.soton.ac.uk/id/eprint/386315
ISSN: 1438-1656
PURE UUID: 6e169ddd-4e6f-4541-aba8-5c9184ae084c
ORCID for Terence G. Langdon: ORCID iD orcid.org/0000-0003-3541-9250

Catalogue record

Date deposited: 01 Feb 2016 09:03
Last modified: 17 Dec 2019 01:50

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